Downloads
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iS6059 SPI – High Volume 3D SPI
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Paste Inspection: iS6052 SPI
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Performance: iS6052 AOI
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iS6059 PCB Inspection Plus – High-Speed 3D AOI
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iS6059 PCB Inspection – High Volume 3D AOI
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iS6059 AOI Double-Sided Inspection
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iS6059 THT Inspection – Bottom-side 3D AOI
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Top-side: iS6052 THT
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iS6052 CCI
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AOI iS6059 Dual-Lane Inspection
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AXI iX7059 One
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Auxiliary modules brochure
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X7056-II – 3D-AXI/3D-AOI
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X8011-III - 3D MXI
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MXI systems: team players for special tasks
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X8068 – 3D-MXI
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iX7059 Heavy Duty Inspection
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iX7059 PCB Inspection/ iX7059 PCB Inspection XL
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Flexible transport solutions for 3D AOI and 3D AXI
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Microfocus X-ray inspection
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S6053BO-V – Inline AOI
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X7056-II BO
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Technology brochure bond
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3D Bond Inspection
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EasyPro3D brochure
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vVision brochure
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Exacom Battery Inspection
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Company Profile
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Service
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The Growing Strengths of 3D AOI
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Inspection Using AI: New Approaches in Quality Control
Today, artificial intelligence comes up time and again as a buzzword — just like Industry 4.0 did not so long ago. For inspection systems used in electronics manufacturing, four main areas of application can be identified in connection with AI: classification in the verification of inspection results, segmentation for optimal defect detection in the context of image processing, simplified creation of inspection programs, and in the area of predictive maintenance to reliably determine future system states. US Tech, 10/2023
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Heights and Depths of Wire Bonds Exactly in View
Electromobility and regenerative energies have given power electronics an enormous boost. The focus here is not least on the quality of the bonding wires. These are also a component of intelligent control systems – now the diameter of the connections can typically range from 20 μm to 400 μm in one and the same product. The height and course of the wire bonds must comply with increasingly precise specifications. A 3D inspection specially designed for this purpose creates added safety. Global SMT & Packaging, 11/2022
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3D Solder Paste Inspection Offers Many Potentials
Practical experience demonstrates that even if SMT lines are equipped with modern 3D SPI systems, their potentials are not always fully utilized. Measurements with a high degree of repeat accuracy, a very wide inspection spectrum, handling options way beyond what is standard plus versatile tools for networking and process control are all available today. Global SMT & Packaging, 10/2022
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3D AXI Process- and Audit- Proof in Manufacturing
The range of applications for inline Xray is greater today than ever before. 2D and 3D inspections can be combined freely in the line cycle – while inspection objects are not only becoming more complex, but in some cases also increasingly larger and heavier. As important drivers, electromobility, renewable energies and state-of-the-art telecommunications electronics have posed new challenges for inline X-ray. Global SMT & Packaging 05/2022
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Highly informative results with 3D AOI - Quality from all perspectives
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. From image quality and analysis of results to the networking of inspection data in order to optimize production processes, the technologies used continue their relentless development. EPP, 11/2019
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Fast in-line X-ray secures quality
High-quality systems for automatic optical inspection (AOI) of electronic assemblies offer as standard features both high throughput and 3D. For hidden solder joints, more and more electronics manufacturers want to employ in-line X-ray systems (AXI) as well. Again, it comes down to fast assembly handling and first-class 3D image quality. One example is the secure detection of voids as required in manufacturing of products with light-emitting diodes (LEDs) and other applications. EPP Europe, 11/2018
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Total control with automatic in-line inspection
Valuable data and images for attaining a stable process Highly effi cient defect detection is not the only capability that makes automatic inspection systems an indispensable element in electronics production. The information they deliver also helps optimize production processes. EPP Europe, 05/2018
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Building Versatility into High-Throughput X-Ray Inspection
3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate manual X-ray inspection (MXI) processes. In the inspection of electronic assemblies, especially for components with hidden solder joints such as BGA or QFN packages, AOI is insufficient. Random samples with MXI are another option, but this is not always the best solution. Where product safety plays an especially crucial role, particularly in the automotive area, a fast, thorough inspection of solder joints is needed. This calls for in-line, high-speed AXI. On these systems, throughput is determined by the inspected assembly handling, since a fully protected housing with mechanical gates is required. US-Tech, 03/2018
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Electronics production in Europe
Ensure competitiveness with intelligent inspection concepts and innovative product ideas In the medium term, only those electronics producers that meet the highest quality requirements and optimize their production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated. Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and permanent improvements in product quality. Constant development of inspection technology is essential. EPP Europe, 05/2017
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Investigation of the self-centering effect with automatic optical inspection (AOI) for dependable processing of 01005 components
A substantial driver behind mounting and connection technology for electronic assemblies is miniaturization, with its objective of highly integrated systems. Where passive components are concerned, this miniaturization has led to introduction of the compact size 01005. The size 01005 refers to two-pole components (chip resistors and chip capacitors) with dimensions of about 400 μm x 200 μm which, depending on the manufacturer and component type, have heights of about 120 μm to 300 μm. Processing these component sizes places considerable demands on the production process as well as the various inspection stages. Plus, 03/2015
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Intelligently networked 3D inspection
DELTEC Automotive GmbH & Co. KG, S3088 SPI and S3088 ultra, January 2017
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The latest transmission controls for utility vehicles – inspected with 3D SPI and 3D AOI from Viscom
WABCO GmbH, S3088 SPI and S3088 ultra, October 2016
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Effective wire bond inspection with combined X-ray and AOI inspection
Danfoss Silicon Power GmbH, X7056BO, July 2014
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Viscom Newsletter No. 39
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Viscom Newsletter No. 38
December 2017
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GTC