S3088 ultra blue – 3D AOI

Price-performance champion

Features

Convincing 3D AOI for the inspection of soldered connections

  • Extremely fast AOI camera system
  • Optimal camera technology for 2/2.5/3D requirements
  • Greatest inspection depth: reliable inspection of 03015 und fine-pitch components
  • Best resolution at angled views
  • Height measurement of components
  • Revolutionary simplicity in AOI operation with vVision
  • Fast program generation with vVision/EasyPro
  • Reading DataMatrix code, bottom up
Viscom-Plus
  • Reliable inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Inspection in the shortest cycle time
  • Lead-free technology fully supported
  • Successful comprehensive IPC-conformant inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Viscom Quality Uplink for optimization of the entire process
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Not enough solderToo much solderMissing solder
Solder bridging/short circuitTombstone effectLifted lead
Solder defectsSolderabilityContamination
Missing componentPolarity errorComponent displaced
RotationComponent damagedIncorrect component
Face down componentComponent on its sideTwisted pin
Damaged pinComponent equipped too much Form defects
Optional:
Open area analysisWobble circle errorColor ring 
analysis
OCRAir holes in the
soldered connection
Solder ball/solder spray
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, storage, and printing of error logs
  • Automated grayscale value calibration for constant inspection results
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
Specifications

Inspection scope

Solder joints, placement, solder paste
Sensor technology

Orthogonal camera module XM:
Field of view: 40 mm x 40 mm (1.57" x 1.57")
Resolution: 8 μm
Number of megapixel cameras: 1

Angled view camera module XM:
Resolution: 16 µm 
Number of megapixel cameras: 4

XM 3D sensor technology:
Range: Up to 30 mm (1.18")
Z resolution: 0.5 μm

Software

User interface: Viscom vVison/EasyPro
SPC: Viscom SPC (statistical process control), open interface (option)
Verification station: Viscom vVerify/HARAN
Remote diagnosis: Viscom SRC (software remote control) (option)
Programming station: Viscom PST34 (option)

System computer

Operating system: Windows®
Processor: Intel® CoreTM i7

PCB handling

PCB dimensions: 508 mm x 508 mm (20" x 20") 
Transport height: 850-950 mm ± 20 mm (33.5"-37.4" ± 0.8")
Width adjustment: Automatic
Positioning unit: Synchronous linear motor
Transport type: Single track transport
PCB clamping: Pneumatic
Upper transport clearance: 50 mm (1.97") optional 
Lower transport clearance: Up to 85 mm (3.35") 

Inspection speed

30–50 cm2/s

Other system data

Interfaces: SMEMA
Power requirements: 208 V (other voltages on request), 3P/N/PE, 15 A
System dimensions: 994 x 1565 x 1349 mm  (39.1" x 61.6" x 53.1") (W x H x D) 
Weight: 800 kg (1764 lbs)

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