Viscom - Inspection Systems for the Electronics Industry

 

Print page

Willkommen bei Viscom Europa

Inspektionssysteme
für die Elektronikindustrie

Leiterplatteninspektion · Sondersysteme · Röntgeninspektion · Halbleiterinspektion
    • Lotpasteninspektion
    • Bestückungsprüfung
    • Lötstelleninspektion
    • Röntgeninspektion
    • Computertomografie (CT)
    • Drahtbondinspektion
    • Kundenspezifische Prüfaufgaben
    • Inspektion von MEMS

 

Neu: Verifikationsplatz vVerify Neu: Verifikationsplatz vVerify
Viscom Process-Uplink Pastenfehler QFP Pad

 

vVerify – the new verification station for vVision

The verification station vVerify for the AOI software vVision allows defect imaged and features to be displayed. Inspection results from the AOI are verified here and a conclusive good/bad evaluation is made. The benefit is that each operator can design his or her "own" classification station. vVerify will  be introduced at the SMT show in Nuremberg…

 

3-D solder paste inspection with Viscom Process Uplink

In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection. In addition to providing  defect detection, the Viscom 3-D SPI can accomplish much more. The SPI-AOI-Uplink function links paste inspection and post-reflow inspection results for both easy and effective process control as well as improved classification of AOI results. The functionality of the Viscom Process Uplink will be demonstrated live at the SMT Show in Nuremberg, Germany…

 

 

 

 

 

 

 

 

  • False parameter or missing country code



Sitemap Imprint