Without electronic subassemblies, many products would be inconceivable. Mobile phones, computers and automotive circuits are becoming ever smaller and more efficient, so printed circuit boards are more and more densely populated with resistors, capacitors, etc. The quality requirements in these branches are also rising steadily.
Automatic optical inspection (AOI)
With the help of the AOI systems, defects during solder paste print, component placement, soldering or final assembly are identified. Viscom inspection systems ensure rapid, reliable, 100% monitoring of the production process.
Automatic X-ray inspection (AXI)
Concealed defects, invisible to cameras, can also be detected with an X-ray inspection. In an age of increasingly compact components and accompanying advances in miniaturization, non-destructive testing (NDT) of details that are hidden from view is gaining importance. This technique makes it possible to avoid reject products, even in the earliest production stages. Classical applications include inspection of die attachments, wire bonding in a sealed state or enclosed within housings, as well as solder joint inspection of concealed assemblies such as BGA, µBGA, FlipChip, Bumps, and connector attachments.
Combined optical and X-ray inspection (AOXI)
In many sectors, automatic optical inspection (AOI) is no longer sufficient. Miniature housings with concealed solder joints are used more and more and also require a cost-effective, reliable inspection. Combining X-ray inspection with automatic optical inspection can "kill two birds with one stone" and so grant high inspection depth and maximum throughput.