Inspection of electronic assemblies for correct placement
Missing or incorrectly placed components are a primary source of defects in production processes. Typical placement defects can include:
- missing components
- misplaced components
- rotated components
- incorrect component polarity
The inspection systems of the S3000 series seek out errors that occur during component placement. The inspection system can be situated directly after the placement system to detect component presence, XY position, rotation and polarity, as well as missing solder paste and solder bridges.
The use of automatic optical inspection (AOI) minimizes placement defects, raises production yield, and reduces repair costs.
Here, a 100 % inspection is possible without negatively affecting process speed. The unique camera technology from Viscom provides the highest inspection speed with full inspection depth.
With the optional Viscom OCR software, it is also possible to record information about the component types used. Usually OCR is assigned where version class or customizing information must be identified, for example, with PROMs or active components.
The OCR function of the Viscom system can not only read the component inscription and so recognize mistakes in the placement system, but also record serial numbers and various component types. A comparison with several permissible component inscriptions (Second Source) is therefore possible.