Highest quality semiconductor inspection in and on the wafer
For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection for surface purity and evenness. Further, inspecting for defects beneath the surface is especially important, as is measurement of the die and the sealant adhesive on MEM components (e.g., sensors).
Inspection scope
- Bare wafer
- Chips
- MEMS
- Wafer bonds
- SOI
- FlipChips
- Applications in the photovoltaic sector
The infrared light sources (semiconductor light matrix: SLM) of the Si-Thru technology emit light at a specific wavelength (around 1 µm), a highly efficient infrared light in a narrow spectrum that is especially well adapted to semiconductor inspection applications. They facilitate a unique detection of embedded defects.
The Viscom inspection systems MX100IR and MX2000IR take on these tasks. The desktop system MX100IR is especially well suited for inspection of smaller lot sizes, while the MX2000IR system is designed for inspection of medium to large lot sizes. One to four cassettes with up to 25 wafers can be loaded automatically without human contact.
