Inspection of solder joints on electronic assemblies
The inspection of faulty solder joints is the chief assignment area for Viscom inspection systems. Defects that frequently arise during SMT production can include:
- open solder joints
- solder bridges
- components with too little or too much solder
- lifted leads
- missing or displaced components
At the same time, solder joint inspection presents significant challenges to the inspection system. Many defects can only be detected through a complex inspection process; critical lifted leads in the fine-pitch range, for example, can only be detected with the use of an angled-view camera.
Viscom inspection systems guarantee defect recognition with maximum precision. The inspection systems of the S6000 series are well known for full defect coverage and the highest throughput - regardless of the complexity of the boards and the flow rates of the production process. Here, the high performance 8M camera technology guarantees maximum inspection depth, even under the extreme cycle times after soldering. Thanks to very short exposure times, image upload speed is exceptionally fast, to satisfy requirements for high throughput. A particular advantage - especially in the case of complex solder joint inspection.
Automatic optical inspection (AOI) after the soldering oven (post-reflow or post-wave) can detect all current defect characteristics, from component type, presence and orientation polarity to the amount of solder paste, cold/open solder joints, bridges, short circuits, tombstones, and more.