X7056 – Automatic in-line 3-D X-ray inspection
highest inspection depth option with AOI integration

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Bestseller among the in-line X-ray systems

  • Inspection of electronic assemblies populated on one or both sides
  • Greatest flexibility through 2-D, 2.5-D or 3-D AXI
  • Highest detail accuracy and fault coverage
  • Wide selection of automated X-ray analyses
  • IPC-compliant inspection library
  • Best in-line AXI resolution on the market
  • Optional AOI integration with no loss of speed
  • Inspection program optimization with Integrated Verification
  • Height measurement of components
  • Reading data matrix code, bottom up
  • Simple operation and inspection program creation with EasyPro/vVision-ready
  • Optional: Open or sealed X-ray tube
  • Minimum footprint in-line
  • Complete system compatibility with the entire Viscom system range
  • Global libraries, global calibration
  • Traceability, SPC, verification, offline programming
  • Customer-specific software adaptation

Insufficient solder

Excessive solder

Missing solder

Solder bridge/short

Tombstone

Lifted lead

Soldering error

Non-wetting

Contamination

Offset print

Smearing of paste

Paste shape defect

Missing component

Polarity

Misplaced component

X placement

Y placement

Rotation

Broken component

Wrong component

Flipped component

Billboarding

Excess component

Form defect

Bent lead

Damaged lead

THT solder joint fillet

Voids

 

 

 

 

 

Optional:

 

 

Surface inspection

Circumference defects

Wicking up effect

Electronic color codes

OCR

Solder balls/splash

Blow holes

BGA head in pillow

 

  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer control
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the classification station
  • Management monitoring through Viscom SPC
  • Automated grayscale value calibration to ensure consistent inspection results
  • Selective X-ray inspection for process optimization (AXI-OnDemand)

X7056 variants

AXI, AOXI

Inspection concept

AXI: 2-D-AXI, 3-D-AXI

AOXI: 2-D-AXI + AOI, 3-D-AXI + AOI

X-ray technology

X-ray tube: Closed X-ray tube

High voltage: 60 - 130 kV

Tube current: 50 - 300 μA

Detector: Viscom 2-D, 2.5-D and 3-D detector, 12 bit grayscale depth

Pixel size: 5, 7 or 10 μm per pixel, switchable

Z-axis adjustment: Powered Z-axis tube adjustment

X-ray cabinet: Designed as a full protection cabinet according to the RöV (German X-ray regulations) dated 30.04.2003 and US standard 21CFR §1020-40 and further international standards, leakage radiation < 1μSv/h

Optical camera technology

Camera module 8M: 8M technology with OnDemandHR

Field of view: 57.6 x 43.5 mm (2.3" x 1.7")

Number of mega pixel cameras: 2 - 12

Resolution (orthogonal): 23.4 μm, 11.7 μm (switchable)

Resolution (angled view): 16.1 μm, 8.05 μm (switchable)

Software

User interface: Viscom EasyPro/vVision ready

Verification station: Viscom HARAN/vVerify ready)

SPC: Viscom SPC (statistical process control),
open interface (optional)

Remote diagnosis: Viscom SRC (software remote control) (optional)

Off-line programming: Viscom PST34
(external Programming station) (optional)

Systematic Defect Analysis and Continuous System Monitoring:
Viscom PDC (ProcessDataControl),
TCM (TechnicalChainManagement)

System computer

Operating system: Windows®

Processor: Intel® Core™ i7

PCB handling

PCB dimensions
(3-D X-ray inspection: dimensional restrictions may occur)

X7056RS: 450 x 350 mm (18.0" x 13.8") (L x W)

X7056RL: 610 x 508 mm (24.0" x 20.0") (L x W)

Transport height: 870 to 960 mm ±20 mm

Width adjustment: Automatic with set-up

Handling unit: Gantry system with maintenance-free high speed drives

Dual track operation: Optional with external PCB modules

PCB clamping: During inspection

PCB edge clearance: 3 mm (0.12")

Upper transport clearance: 35 mm (1.38")

Lower transport clearance: 50 mm (1.97")

Inspection speed

AOI: Typical 20 – 40 cm²/s

AXI: Depends on application

Other system data

Interfaces: SMEMA, SV70, customer specific

Power requirements: 230/400 V (208/400 V US), different voltages by request, 3 phases, 50/60 Hz, 5 kW

System dimensions

X7056RS: Approx. 1266 x 2184 x 1626 mm
(49.8" x 86.0" x 64.0") (W x D x H)

X7056RL: Approx. 1738 x 3166 x 1626 mm
(68.4" x 124.6" x 64.0") (W x D x H)

Line integration dimensions:
X7056RS: +25 mm (1.0"), X7056RL: +25 mm (1.0")

Weight: X7056RS: Approx. 2500 kg (5511 lbs),
X7056RL: Approx. 3200 kg (7055 lbs)

 

 

Uwe Schulze, Zollner Elektronik AG, verantwortlich für AOI undAXI

Uwe Schulze,
Zollner Elektronik AG, responsible for AOI and AXI inspection applications

"It doesn't always make sense to 3D X-ray the entire assembly. The cycle time is simply shorter when an AOI is also used. Viscom systems make it possible to graduate the inspection. The more I can inspect optically, the faster is the entire inspection. We have never had such flexibility before; this presents a true advantage."

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download System brochure

download Auxiliary modules
      brochure

download Case study
      Rommtech B.V.

download Case study
      Zollner Elektronik AG

download Case study
      Kapsch Components KG

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