SPI - Inspecting electronic assemblies for solder paste print without defects
Viscom inspection systems inspect paste print quality reliably and at high speed.
Frequently occurring defects include missing or displaced solder paste, or an insufficient paste height. Because in SMD assembly the characteristics of the paste deposit also have a decisive influence on the entire process, the SPI inspection is a good approach for defecting defects early in the production process so negative trends can be recognized at the very start.
To accomplish this, the inspection system S3088 SPI provides a solder paste inspection which in addition to displacement, completeness and smearing, also checks the height, surface area and volume of the paste with high precision measurement technology.
Defects located with the 3-D solder paste inspection can also be transferred to a post-reflow AOI system. This additional transfer of borderline defects enables a unique use of the SPI system.
