S3088 SPI – High performance 3-D solder paste inspection with Quality Uplink
Reliable 3-D SPI with process control
- Capture and control all essential 3-D features
- Calibration-free 3-D technology
- Reliable inspection of demanding electronic assemblies
- Integrated tracking height
- Height measurement of components
- Reading data matrix code, bottom up
- Viscom Quality Uplink: simple verification and process optimization
- Simple process analysis with the Viscom uplink analyzer
- less scrap and higher first-pass yield
- Print optimization through linking with printer (downlink)
- Simple operation and inspection program creation with Viscom EasyPro
- Complete system compatibility with the entire Viscom system range
- Traceability, SPC, verification, offline programming
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Insufficent solder |
Excessive solder |
Missing solder |
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Solder bridge/short |
Contamination |
Offset print |
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Smearing of paste |
Paste shape defect |
X placement |
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Y placement |
Rotation |
Form defect |
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Optional: |
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Surface inspection |
OCR |
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Label printers and bad board markers control
- Intelligent FIFO buffer control
- Preparation, storage and printing of error logs
- Flexible single- and multi-line utilization of the verification and repair station
- Management monitoring through Viscom SPC
- User-friendly real image display providing a better verification
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Application |
3-D solder paste inspection |
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Camera technology |
Measurement method: Fringe projection process Pixel size: 15 μm |
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Software |
User interface: Viscom EasyPro/vVision-ready SPC: Viscom SPC (statistical process control), open interface (option) Verification station: Viscom S6002 HARAN/vVerify-ready Remote diagnosis: Viscom SRC (software remote control)(option) Programming station: Viscom PST34 (option) |
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System computer |
Operating system: Windows® Processor: Intel® Core™ i7 |
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PCB handling |
PCB dimensions: Max. 508 x 508 mm (20" x 20") (L x W) PCB support: Optional Transport height: 850 to 950 mm ± 20 mm (33.5" x 37.4") Width adjustment: Automatic during setup Positioning unit: Synchronous linear motor Transport concept: Single track transport PCB clamping: Electrical Upper transport clearance: 30 mm (1.1") Lower transport clearance: 40 mm (1.5") (60 mm (2.3") option) |
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Inspection speed |
Up to bis zu 80 cm²/s |
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Other system data |
Interfaces: SMEMA, SV70 Power requirements: 190 V to 600 V, 50/60 Hz, 3P/N/PE, consumption 2.5 kVA/h, System dimensions: 1000 x 1540 x 1600 mm (39.4" x 60.6" x 63") (W x D x H) Weight: Max. 750 kg (1653 lbs) |
