Secure defect recognition in wire bond connections
The trend in electronics production is heading in the direction of higher integration density and cost-effective production with constantly higher quality. In the microsystem technology sector, the quality of wire bond connections in gold wire or thick wire bonding is being inspected inline.
Inspection scope:
- ball defects
- wedge defects
- wire defects
- die defects
- conductive adhesive defects
High resolution cameras register every bond site and bond wire. The resulting digitalized images are automatically evaluated by high performance software. This allows a high-speed inspection and therefore, a one hundred percent inline inspection.
Connection to the high performance SPC allows the systems to be operated in a continuous loop for bonder control.
The Inspection systems S6053BO-V and S6056BO can be integrated directly into the production line and function fully automatically. To inspect medium and small product runs the desktop AOI S2088BO-II is available.
