Rising requirements for quality, especially in the automobile, aerospace and aeronautics industries, or in medical technology, often call for inspection of concealed areas in electronic or mechanical assemblies. For this reason, more and more companies are turning to microfocus X-ray inspection for non-destructive testing (NDT).
These X-ray inspection systems are used not only for small series and prototype production, for optimizing process development, and for random-sample testing in high-throughput production lines, but also for 100 % inspection within production lines.
A special highlight from the Viscom X-ray product range is the system family for combined AOI/AXI inspection of printed circuit boards populated on one or both sides. These systems combine a time-proven visible light inspection with the benefits of microfocus X-ray inspection. The X7056 enables a high-performance 3D X-ray inspection (AXI) with parallel automatic optical inspection, to meet requirements for high throughput. This configuration allows reliable inspection of concealed components and solder joints, for example in SMD, BGA and THT subassemblies.