X8011 PCB – High performance X-ray inspection for SMT/electronics
With the X8011 PCB, Viscom offers a smart and economical X-ray inspection system. The application scope reaches from random sample analysis and special inspection of individual components, up to automatic start-up support and small series inspection. Thanks to integration of the proven automatic SI inspection analyses, the system is ideally suited for high-mix low-volume manufacture in which only a few components need to be X-rayed.
The heart of the X-ray technology is the open microfocus transmission tube (up to 200 kV). Optionally, a sealed direct beam tube (up to 130 kV) can also be employed. Both tubes are distinguished by their stable X-ray radiation during continuous operation. For the highest magnifications and best image quality, a digital flat panel detector which can also be used in angled radiation is employed. For special inspections or non-standard components, the Viscom XMC software is available on the system. With the intuitive operation and comprehensive analysis functions, the inspection objects can be easily and precisely checked. Even further, 3-D reconstruction with the Viscom proprietary computed tomography is also possible here. Thus, in addition to the improved localization of defects, individual slices or section images can also be visualized with this process.
The particular strength of the system is the fully automatic Xray analysis with the Viscom software SI. It cumulates over 25 years' experience in assembly inspection and is specially oriented to SMD production. With it, now the well-known Viscom inspection depth of the X7056 in-line family is also available for the off-line world. An additional advantage for Viscom customers is the uniform user interface, under which the X8011 PCB now can also be operated. This saves training expense, and facilitates direct communication between the systems and synchronization of the results.
Thus the X8011 PCB can be equipped with the unique Viscom Quality Uplink. Through the linking of inspection results from SPI, AOI, AOI and AXI, this function provides for a simplified classification and effective process control. For example, all inspection data from the Viscom 3-D solder paste inspection can be displayed directly on the verification station of the X8011 PCB. Cause study and correction of process errors is therefore very easily realized.
Highlights
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Two inspection concepts in one system
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High performance open microfocus transission tube, optional direct beam tube
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Highest magnification and excellent image quality
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Optional use of flat panel detectors
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Intuitive operation and comprehensive analysis function:
Viscom XMC and Viscom SI -
Upgradable with Viscom proprietary computed tomography
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EasyClick principle for easy mounting of handling units
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Unique Viscom Quality Uplink for simplified classification and effective process control
