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Inspection Systems for
  the Electronics Industry

Inspection Systems for the Electronics Industry

 

Welcome to Viscom Americas

 

Viscom Inc.'s 10th Anniversary Viscom Inc.'s 10th Anniversary
Wire bond inspection with S6053BO-V Viscom S6053BO-V - the system for automatic wire bond inspection

 

S6053BO-V - the inspection system for extremely small wire diameters

Viscom's S6053BO-V brings the newest generation of fully automatic wire bond inspection systems to market. It was conceived specifically for small wire bond analysis. Both the camera technology as well as the transport can be adapted to the most widely varying production demands...

 

Viscom Inc. celebrates 10th Anniversary

In October of 1998, Viscom Inc. took a big step toward a successful future by moving into their first U.S. office in Norcross, Georgia...

 

 

 

  • Company
    • Profile
      • Viscom Americas
      • German Headquarters
    • Philosophy
    • History
      • 2000 - 2008
      • 1984 - 1999
    • Executive Board
  • Products
    • Product Overview
      • References
      • Customer Statements
    • Application Areas
      • Inspection Solutions for the SMD Line
      • Electronics Industry
      • Automobile Industry
      • Semiconductor Industry
      • Aviation/Aerospace Industry
        • Actuation Systems
      • Drive Systems
        • Motor Regulator
    • Software
      • Repair Station S6002
      • VPC - Statistical Process Control
      • Programming Station PST34
      • EasyPro3D
    • Semiconductor Inspection
      • MX100IR
      • MX2000IR
    • Solder Joint Inspection
      • Optical Inspection
        • Desktop-System S2088
        • PCB underneath System S3016
        • Selective Solder Inspection S3054QC
        • Universal System S3088-II
        • High-End System S6056
      • Optical/2-D X-ray Inspection
        • X8051
        • X8051-II
      • Optical/3-D X-ray Inspection
        • X7056
    • Placement Inspection
      • Universal System S3088-II
      • Basis System S3054QV
    • Solder Paste Inspection
      • Universal System S3088-II
      • Basis System S3054QS
    • Bond Inspection
      • S6053BO-V/S6056BO
    • X-ray Inspection
      • X7056
      • Ultra Compact System X8008
      • Compact System X8011
      • X8051
      • X8051-II
      • X8060 NDT
    • Computed Tomography
      • Compact System X8011CT
      • X8060 NDT
    • Photovoltaics
      • S2012PV
    • Final Assembly Inspection
      • Inspection Cell S3012OOE
      • Inspection Cell S3012ROB
      • S3024 CombiCheck
    • Special Solutions
      • Finish Inspection S3070 AFI-Scan
      • Thick-Film Inspection PrintScan
      • Interior Inspection S3099 EndoSpect
    • X-ray Tubes
      • XT9000
  • Sales/Contact
    • Viscom Americas
    • Headquarters
      • Contact Sales
      • Contact Business Units
        • NP
        • SP
        • XP
        • IP
      • Contact Sales Office
      • Contact Service
      • Contact Marketing
      • Plant Layout
      • Directions Headquarters
    • Sales Worldwide
      • Europe
      • Asia
      • Africa
      • Text Version
  • Support
  • Press
    • Press Releases
      • Current
      • Archive
    • Image Archive
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  • Trade Fairs/Events
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      • Recent Trade Fairs
    • Events
  • Information Material
    • Brochures
      • English
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    • Case Studies
    • Newsletter
  • Careers

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