MX2000IR – Wafer AOI

Features

Fully automated wafer inspection with a handling unit for for medium and large lot sizes

  • Infrared illumination - transmitted light and reflected light
  • Higher throughput
  • Non-destructive inspection of the wafer's surface and interior
  • Automated reading of wafer identification and pre-alignment parallel to inspection.
  • Direct identification of each wafer by code reading (barcode, data matrix code, OCR)
  • Automatic loading and unloading
Viscom-Plus
  • Robust short-cycle inspections
  • Customer-specific software adaptation
  • Minimum footprint in line
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
Specifications
ApplicationBare wafer, chips, MEMS, wafer bond, SOI, FlipChip, photovoltaics
Inspection mode

Automatic inspection algorithms using user-defined pass/fail criteria
Possibility of "Pass/Fail" for each device and wafer, defect classification
Wafer-level scanning mode

Camera technology

High resolution near-infrared (NIR) CCD-camera:
Illumination: Infrared light source (Semiconductor Light Matrix  (IR-SLM))
Resolution: 3.5 μm/pixel standard; 0.7 - 10 μm/pixel available depending
on application and customer requirements

Die-level inspectionDevice size: Typical 2 x 2 mm, up to 10 x 10 mm
Wafer

Diameter: Up to 300 mm
Thickness: Up to 2000 μm
Wafer alignment: Referencing to fiducials with adjustment for rotation
and translation

Inspection speedUp to 25 wafers per hour depending on resolution and wafer size
Options

Automatic wafer operation
Configurable image size
Configurable illumination, multiple options
Customer-specific vacuum chuck or other mechanical fitting
GEM/SECS communication interface

Other system data

Voltage: 100-240 VAC, 50/60 Hz
System dimensions: 1813 x 1320 x 1803 mm (71.4" x 52.0" x 71.0") (W x D x H)
Weight: 900 kg (1984 lbs)

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