S6056 MID – 3D MID AOI

Features

Reliable quality assurance for MID products

  • 3D assembly inspection
  • Powerful, scalable 8M color sensors with orthogonal and angled viewing
  • Comprehensive inspection range
  • Handling adaptable to the inspection task
  • High-precision XY linear motor axis system ensures highly accurate positioning
  • Z-axis for inspecting different 3D MID levels
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • In-line capability enables inspection of rapid throughput
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Customer-specific software adaptation
  • Comprehensive flexibility: Optional inspection after every process step
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Specifications
Transport system

S6056 MID ST1: Single track
S6056 MID DS1W: Dual track

Inspection conceptST1; DS1W: Single inspection
ApplicationSolder joint, assembly, solder paste, metallization,
laser direct structuring (LDS)
Camera technology

Orthogonal camera module 8M (white LEDs):
Field of view: 57.6 x 43.5 mm (2.3" x 1.7")
Resoluation: 23.5 μm (standard), 11.75 μm (high) switchable
Number of mega pixel cameras: 4
Z-axis: Lift 40 mm (1.6")

Angled view camera module 8M (white LEDs):
Resolution: 16.1 μm (standard), 8.05 μm (high) switchable
Number of mega pixel cameras: 4, 8 (optional)
Z-axis: Lift 40 mm (1.6")

Software

User interface: ST1: Viscom EasyPro/vVision; DS1W: Viscom EasyPro/vVision-ready
Verification station: ST1: Viscom vVerify/HARAN; DS1W: HARAN
SPC: Viscom SPC (statistical process control), open interface
(optional)
Remote diagnosis: Viscom SRC (optional)
Off-line programming: Viscom PST34 (external Programming Station)
(optional)

System computer

Operating system: Windows®
Processor: Intel® Core™ i7

PCB handling

PCB dimensions (L x W):
ST1; DS1W: 420 x 356 mm (16.5" x 14")
PCB carrier: 1 - 5 mm (0.04" x 0.2") (lower thicknesses optional)
Transport height: 850 to 960 mm ± (33.5" x 37.8")
Width adjustment: Automatically with set-up
Handling unit: Linear motors
PCB clamping: Pneumatic during inspection
PCB contact area: 3 mm (0.12")
Upper transport clearance: 35 mm (1.39") (50 mm (1.97") (optional)
Lower transport clearance: 50 mm (1.97") (other heights upon request)

Inspection speed

ST1: 20 - 40 cm2 /s
DS1W: 20 - 40 cm2 /s, no handling time

Other system data

Interfaces: SMEMA, SV70, customer specific
Power requirements: 400 V (other voltages on request), 3P/N/PE, 8 A 
Line gap requirements: System width approx. +30 mm (1.18")
System dimensions (W x D x H):
ST1: 1100 x 1650 x 1692 mm (43.3" x 64.9" x 66.6");
DS1W: 1528 x 1650 x 1692 mm (60.2" x 64.9" x 66.6")
Weight (max.): ST1: 1400 kg (3086 lbs); DS1W: 1700 kg (3747 lbs)


 

 

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