S3088 ultra – High-Speed 3D AOI

S3088 ultra gold

Features

Very reliable high-speed 3D inspection for soldered connections

  • Extremely fast AOI camera system
  • Scalable, modular camera technology with 3D measuring function
  • Greatest inspection depth: reliable inspection of 03015 and fine-pitch components
  • Maximum fault coverage - 9 views plus 3D measurement
  • Best resolution at angled views
  • Height measurement of components
  • Extremely high throughput due to FastFlow Handling
  • Fast program generation with vVision/EasyPro
  • Reading DataMatrix code, bottom up
Viscom-Plus
  • Reliable inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Inspection in the shortest cycle time
  • Lead-free technology fully supported
  • Successful comprehensive IPC-conformant inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Viscom Quality Uplink for optimization of the entire process
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Not enough solderToo much solderMissing solder
Solder bridging/short circuitTombstone effectLifted lead
Solder defectsSolderabilityContamination
Missing componentPolarity errorComponent displaced
RotationComponent damagedIncorrect component
Face down componentComponent on its sideTwisted pin
Damaged pinComponent equipped too much Form defects
Optional:
Open area analysisWobble circle errorColor ring
analysis
OCRAir holes in the
soldered connection
Solder ball/solder spray
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, storage, and printing of error logs
  • Automated grayscale value calibration for constant inspection results
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
Specifications
S3088 ultraS3088 ultra gold
Inspection scope
Solder joints, placement, solder paste
Camera technologyXMXMplus
Total number of megapixelsUp to 65Up to 121
Positioning unitSynchronous linear motor
3D sensor technology
- Z-resolution0.5 µm
- RangeUp to 30 mm (1.2")
- Lateral resolution 16 µm 10 µm
Angular view camera module
- Number of cameras4 (8, optional)8
Orthogonal camera module
- Resolution8 µm10 µm
- Field of view40 mm x 40 mm (1.6" x 1.6")50 mm x 50 mm (2" x 2")
Inspection speed
Up to 50 cm²/sUp to 65 cm²/s
Software
User interfaceViscom vVision/EasyPro
SPC Viscom SPC (statistical process control), open interface (optional)
Verification stationViscom vVerify/HARAN
Remote diagnosis

Viscom SRC (software remote control) (optional)

Programming stationViscom PST34 (optional)
System computer
Operating systemWindows®
ProcessorIntel® Core™ i7
PCB handling
PCB dimensions508 mm x 508 mm (20" x 20")
PCB supportOptional
Transport height850 - 950 mm ± 20 mm (33.5" - 37.4" ± 0.8")
Width adjustmentAutomatic
Transport conceptSingle track transport
PCB clampingPneumatic
Upper transport clearance50 mm (2")
Lower transport clearanceUp to 85 mm (3.4"), 40 mm (1.6") with PCB support
Other system data
InterfacesSMEMA, SV70
Power requirements400 V (other voltages on request), 3P/N/PE, 8 A
System dimensions997 mm x 1600 mm x 1540 mm (39.3" x 63" x 60.6") (W x H x D)
WeightMax. 800 kg (1764 lbs)

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