X7056RS – AXI/AOI

Features

Bestseller among in-line X-ray systems

  • Inspection of electronics assemblies populated on one or both sides
  • Greatest flexibility through 3D, 2.5D or 2D AXI
  • Flat Panel Detectors (FPD) or image intensifiers (depending on application)
  • High inspection depth through XM 3D or 8 M camera technology
  • Viscom Quality Uplink: process optimization and first-pass yield increase
  • Comprehensive IPC-compliant AXI inspection library
  • Best in-line AXI resolution for maximum fault coverage
  • Optional AOI integration with no loss of speed
  • Optional: Open or sealed X-ray tube
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptation
  • Minimum footprint in line
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 20 years of AXI experience included
Defect coverage
Insufficient solderExcessive solderMissing solder
Solder bridging/short circuitTombstoningLifted lead
Soldering errorNon-wettingContamination
Missing componentPolarity defectDisplaced component
RotationDamaged componentIncorrect component
Face down componentBillboardingExcess component
Form defectBent leadDamaged lead
THT filling degree
Optional:
Open area inspectionCircumference defectsWicking-up effect
Electronic color codesOCRSolder balls/splash
BlowholesBGA head-in-pillow
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer control
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the classification station
  • Management monitoring through Viscom SPC
  • Automated grayscale value calibration to ensure consistent inspection results
  • Selective X-ray inspection for process optimization (AXI-OnDemand)
Specifications

Variants

AXI | AOI/AXI
Inspection concept

AXI: 2D AXI | 3D AXI
AOI/AXI: 2D AXI + AOI | 3D AXI + AOI

X-ray technologyX-ray tube: Closed X-ray tube
High voltage: 60 - 130 kV
Tube current: 50 - 300 μA
Detector: Viscom 2D, 2.5D and 3D detector,
12 Bit grayscale depth
Flat Panel Detector, 14 Bit grayscale depth
Resolution: Image intensifier: 5, 7, 10 μm/pixel, FPD: 8, 10, 20 µm/pixel, switchable
Z-axis adjustment: Powered Z-axis tube adjustment
X-ray cabinet: In compliance with the German X-Ray Regulations (RöV) regarding fully protected devices. Leakage radiation < 1μSv/h
Camera technologyOrthogonal camera module XM: 
Field of view: 40 mm x 40 mm (1.57" x 1.57")
Resolution: 16 μm (standard), 8.3 μm (high) switchable with onDemandHR
Number of mega pixel cameras: 1

Angled view camera module XM:
Resolution: 16 μm (standard)
Number of mega pixel cameras: 4/8 (optional)

XM 3D camera technology:
Range: Up to 30 mm (1.18")
z Resolution: 0.5 µm

8M camera technology (optional)

Software

User interface: Viscom EasyPro/vVision ready
Verification station: Viscom HARAN/vVerify ready
SPC: Viscom SPC (statistical process control), open interface (optional)
Remote diagnosis: Viscom SRC (software remote control) (optional)
Off-line programming: Viscom PST34 (external Programming Station) (optional)
Systematic Defect Analysis and Continuous System Monitoring:
Viscom PDC (ProcessDataControl),
TCM (TechnicalChainManagement)

System computer

Operating system: Windows®
Processor: Intel® Core™ i7

PCB handling

PCB dimensions (3D X-ray inspection: dimensional restrictions may occur):
X7056RS: up to 450 mm x 350 mm (18" x 13.8") (L x W);
X7056RL: 610 mm x 508 mm (24" x 20") (L x W)
Transport height: 850 to 980 mm ± 20 mm (33.5" to 38.6" ± 0.8")
Width adjustment: Automatic with set-up
Handling unit: Gantry system with maintenance-free high speed drives
Dual track operation: Optional with external PCB modules
PCB clamping: During inspection
PCB edge clearance: 3 mm (0.12")
Upper transport clearance: Up to 35 mm (1.4"); FPD with 8 µm resolution: 20 mm (0.8")
Lower transport clearance: 55 mm (2.2")

Inspection speedAOI: 40 - 60 cm²/s, no handling time
AXI: Depends on application
Other system data

Interfaces: SMEMA, SV70, customer specific
Power requirements: 400 V (other voltages on request), 3P/N/PE, 8 A
System dimensions:
X7056RS: approx. 1266 x 1626 x 2184 mm (49.8" x 64" x 86") (W x H x D) 
X7056RL: approx. 1738 x 1626 x 3166 mm (68.4" x 64" x 124.6") (W x H x D)
Line integration dimensions:
X7056RS: +25 mm (1.0");
X7056RL: +25 mm (1.0")
Weight:
X7056RS: approx. 2500 kg (5511 lbs);
X7056RL: approx. 3600 kg (7936 lbs)

 

 

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