S3088 SPI – 3D SPI

Features

Reliable 3D SPI with Quality Uplink, process control and DualView

  • Precise control of all essential 3D features; calibration-free
  • Extremely high throughput due to FastFlow Handling
  • Integrated height tracking 
  • Viscom Quality Uplink: process optimization and first-pass yield increase
  • Simple process analysis with the Viscom Uplink Analyzer
  • Fast program generation 
  • Print optimization through interlinkage with printer (closed loop)
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • Robust short-cycle inspections
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming and much more
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Simple process analysis with the Viscom Uplink Analyzer
  • Over 30 years of AOI experience included
Defect coverage
Insufficent solderExcessive solderMissing solder
Solder bridge/short circuitContaminationOffset print
Smearing of pastePaste shape defectX placement
Y placementRotationForm defect
Optional:
Surface inspectionOCR
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer control
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
Specifications
S3088 SPIS3088 SPI DualView
Application 3D solder paste inspection3D solder paste inspection
Camera technology

Measurement method

Fringe projection process

Fringe projection process

Pixel size15 µm15 µm
Software

User interface

Viscom EasyPro/
vVision-ready

Viscom EasyPro/
vVision-ready
SPCViscom SPC (statistical process control), open interface (option)Viscom SPC (statistical process control),
open interface (option)
Verification stationViscom HARANViscom HARAN
Remote diagnosisViscom SRC (option)Viscom SRC (option)
Programming stationViscom PST34 (option)Viscom PST34 (option)
System computerOperating system

Windows®

Windows®
ProcessorIntel® Core™ i7 Intel® Core™ i7
Performance data
Measurement
specifications
Repeatability
Height evaluation
< 1 % @ 3 σ (on certification target)<< 1 % @ 3 σ (on
certification target)
Repeatability
Volume evaluation
< 3 % @ 3 σ (on paste)<< 3 % @ 3 σ (on paste)

Gage R&R Volume evaluation

<< 10 % @ 6 σ
(on paste)
<< 5 % @ 6 σ (on certification target)

<< 5 % @ 6 σ
(on paste)
<< 2 % @ 6 σ (on certification target)
Height measurement accuracy2 µm
(on certification target)
2 µm
(on certification target)
PastePaste height max. 500 µm500 µm
Paste height min.50 µm50 µm
Paste surface max.15 x 15 mm
(0.6" x 0.6")
15 x 15 mm
(0.6" x 0.6")
Paste surface min.150 x 150 µm100 x 100 µm
PCB handlingPCB dimensions max.508 x 508 mm
(20" x 20")
450 x 508 mm
(17.7" x 20") (L x W)
PCB dimensions min.50 x 50 mm
(2" x 2")
50 x 50 mm
(2" x 2") 
PCB supportOptionOption
Transport height850 to 950 mm ± 20 mm
(33.5" x 37.4")
850 to 950 mm ± 20 mm
(33.5" x 37.4")
Width adjustmentAutomaticAutomatic
Positioning unitSynchronous linear motorSynchronous linear motor
Transport conceptSingle track transportSingle track transport
PCB clampingPneumaticPneumatic
Upper transport clearance35 mm (1.1")35 mm (1.1")
Lower transport clearance50 mm (2"), up to 85 mm (3.4") (optional), 
40 mm (1.6") with PCB support
50 mm (2"), up to 85 mm (3.4") (optional),
40 mm (1.6") with PCB support
Inspection speed (Standard)
Up to 80 cm²/s (HighRes 15 µm)
Up to 200 cm²/s (HighSpeed 30 μm)
Up to 80 cm²/s
(HighRes 15 μm)
Up to 200 cm²/s
(HighSpeed 30 μm)
Inspection speed
(DualView)
-Up to 40 cm²/s
(HighRes 15 µm)
Up to 80 cm²/s
(HighSpeed 30 µm)
Other system dataInterfaces

SMEMA, SV70

SMEMA, SV70
Power requirements

400 V (other voltages on request),
3P/N/PE, 8 A

400 V (other voltages on request), 3P/N/PE, 8 A

System dimensions997 x 1600 x 1540 mm
(39.3" x 63" x 60.6") (W x H x D)

997 x 1600 x 1540 mm
(39.3" x 63" x 60.6") (W x H x D)

Weight max.750 kg (1653 lbs)750 kg (1653 lbs)

 

 

 

Zur optimalen Darstellung der Webseite muss Javascript in Ihrem Browser aktiviert sein.