S2088BO-II – Desktop AOI

Features

Reliable wire bond control with desktop AOI

  • Precise, positive inspection down to 17 μm wire diameters
  • Wider inspection scope
  • Very simple inspection program generation
  • Economical AOI solution
  • Completely compatible with Viscom in-line systems
  • Additional advantages as programming station
Viscom-Plus
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision-ready
  • The uniform camera technology ensures full inspection program compatibility
  • Traceability, SPC, verification, off-line programming, and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptation
  • Customer-specific conveyor concepts are possible
  • Minimum footprint in line
  • Over 20 years bond AOI experience included
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High performance OCR software
  • Over 30 years of AOI experience included
Specifications
ApplicationBall-bond, wedge bond, wire, die/SMD
Camera technology

Ultra-high resolution VHR module:
Number of modules per machine: Typical 1
Number of mega pixel cameras: 1
Pixel size: Typical 5 μm/pixel or 2.5 μm/pixel, further cameras avialable on request

Standard module 8M-1SRWBond:
Number of modules per machine: Typical 1
Number of mega pixel cameras: 1
Pixel size: Typical 10 μm/pixel, further cameras avialable on request

Software

User interface: Viscom EasyPro
Verification station: Viscom HARAN (integrated into system)
SPC: Viscom SPC (statistical process control), open interface (optional)
Remote diagnosis: Viscom SRC (software remote control) (optional)
Off-line programming: Viscom PST34 (external Programming Station) (optional)

System computer

Operating system: Windows®
Processor: Intel® Core™ i7

PCB handling

Substrate dimensions: 8M-1SRWBond: 600  467 mm (23.6" x 18") (L x W)
VHR module: 152 x 127 mm (5.9" x 5") (L x W), other sizes on request
PCB thickness: 1.0 - 6.0 mm (0.04" - 0.24")
Width adjustment: Manual
Handling unit: Synchronous linear motors
PCB clamping: Mechanical, upwards
PCB contact area: 2.4 mm (0.09")
Upper transport clearance: 15/35 mm (0.59"/1.38") (depending on camera technology − other camera options available on request)
Lower transport clearance: 60 mm (2.36")

Inspection speedUp to 1000 wire bond connections/min.
depending on inspection object characteristics
Other system data

Power requirements: 110 - 240 V, 1P/N/PE, 10 A
Systen dimensions: 1040 x 1476 x 1210 mm (40.9" x 58.1" x 47.6") (L x H x W)
Weight: Max. 140 kg (308 lbs) (without work table)

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