S3088 UFI – AOI


Reliable underfill inspection

  • Extremely high throughput due to FastFlow Handling 
  • Revolutionary simplicity in AOI operation with vVision
  • Scalable camera technology and switchable resolution (OnDemandHR)
  • Best resolution at angled views
  • Height measurement of components
  • Reading DataMatrix code, bottom up
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using Viscom standard library for solder joint inspection
  • Lead-free technology fully supported
  • Successful comprehensive IPC-conformant inspection library
  • Customer-specific and customizable software adaptation
  • User interface available in multiple languages
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years AOI experience included
Defect coverage
Excess underfillX/Y displacementRotation
Insufficient underfillWrong componentInverted component
Missing underfillMissing componentComponent on its side
Missing componentComponent damagedExcess components
Displaced component
Insufficient solderExcess solderMissing solder
Solder bridge/short circuitTombstone effectLifted lead
Solder defectSolderabilityContamination
Wrong polarityTwisted pinDamaged pin
Form defectsOpen area analysisWobble circle error
Color ring analysisOCRVoids in the solder joint
Solder ball/solder spray
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, filing, and printing of defect logs
  • Automated grayscale value calibration for constant inspection results
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
Inspection scopeUnderfill inspection(optional: selective soldering, full-surface wave soldering, assembly inspection)
Camera technology
8M orthogonal camera module8M angular view module (optional)
Image field size
57.6 x 43.5 mm
Resolution11.75 μm8 μm
Number of megapixel cameras44 or 8
User interfaceViscom EasyPro/vVision
SPC Viscom SPC (statistical process control), open interface (optional)
Verification stationViscom HARAN/vVerify
Remote diagnosis

Viscom SRC (optional)

Programming stationViscom PST34 (optional)
System computer
Operating systemWindows®
ProcessorIntel® Core™ i7
PCB handling
PCB dimensions508 x 508 mm (20" x 20") (L x W)
Transport height900 - 950 mm ± 20 mm (35.4" - 37.4" ± 0.8")
Width adjustmentAutomatic during setup
Transport conceptSingle track transport
PCB clampingPneumatic
Upper transport clearance50 mm (2")
Lower transport clearance60 mm (2.4")
Inspection speed
20 - 40 cm²/s
Other system data 
Positioning/handling unitSynchronous linear motors
Power requirements230 V (other voltages on request), 1P/N/PE, 10 A
System dimensions994 mm x 1565 mm x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D)

600 kg (1323 lbs)


Subject to technical changes. Windows® and Intel® Core™ i7 are registered trademarks.



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