S6056 MID – 3D MID AOI

Features

Reliable quality assurance for MID products

  • 3D assembly inspection
  • Powerful, scalable 8M color sensors with orthogonal and angled viewing
  • Comprehensive inspection range
  • Handling adaptable to the inspection task
  • High-precision XY linear motor axis system ensures highly accurate positioning
  • Z-axis for inspecting different 3D MID levels
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • In-line capability enables inspection of rapid throughput
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Customer-specific software adaptation
  • Comprehensive flexibility: Optional inspection after every process step
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Specifications
Transport system

S6056 MID ST1: Single track
S6056 MID DS1W: Dual track

Inspection conceptST1; DS1W: Single inspection
ApplicationSolder joint, assembly, solder paste, metallization,
laser direct structuring (LDS)
Camera technology

Orthogonal camera module 8M (white LEDs):
Field of view: 57.6 mm x 43.5 mm (2.3" x 1.7")
Resoluation: 23.5 μm (standard), 11.75 μm (high) switchable
Number of megapixel cameras: 4
Z-axis: Lift 40 mm (1.6")

Angled view camera module 8M (white LEDs):
Resolution: 16.1 μm (standard), 8 μm (high) switchable
Number of megapixel cameras: 4, 8 (optional)
Z-axis: Lift 40 mm (1.6")

Software

User interface: ST1: Viscom EasyPro/vVision; DS1W: Viscom EasyPro/vVision-ready
Verification station: ST1: Viscom vVerify/HARAN; DS1W: HARAN
SPC: Viscom SPC (statistical process control), open interface
(optional)
Remote diagnosis: Viscom SRC (optional)
Off-line programming: Viscom PST34 (external Programming Station)
(optional)

System computer

Operating system: Windows®
Processor: Intel® Core™ i7

PCB handling

PCB dimensions (L x W):
ST1; DS1W: 420 mm x 356 mm (16.5" x 14")
PCB carrier: 1 - 5 mm (0.04" - 0.2") (lower thicknesses optional)
Transport height: 850 - 960 mm ± 20 mm (33.5" - 37.8")
Width adjustment: Automatically with set-up
PCB clamping: Pneumatic during inspection
PCB contact area: 3 mm (0.12")
Upper transport clearance: 35 mm (1.39") (50 mm (1.97") (optional)
Lower transport clearance: 50 mm (1.97") (other heights upon request)

Inspection speed

ST1: 20 - 40 cm2 /s
DS1W: 20 - 40 cm2 /s, no handling time

Other system data

Positioning/handling unit:Synchronous linear motors
Interfaces: SMEMA, SV70, customer specific
Power requirements: 400 V (other voltages on request), 3P/N/PE, 8 A 
Line gap requirements: System width approx. +30 mm (1.18")
System dimensions (W x D x H):
ST1: 1100 x 1650 x 1692 mm (43.3" x 64.9" x 66.6");
DS1W: 1528 x 1650 x 1692 mm (60.2" x 64.9" x 66.6")
Weight (max.): ST1: 1400 kg (3086 lbs); DS1W: 1700 kg (3747 lbs)


 

 

Zur optimalen Darstellung der Webseite muss Javascript in Ihrem Browser aktiviert sein.

To give you the best possible service, this website uses cookies. By continuing to use our website, you agree to the use of cookies.
OK