S3088 basic – AOI

Features

Full Viscom 2.5D defect detection coverage for placement and solder joint inspection 

  • Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering
  • Revolutionary simplicity in AOI operation with vVision
  • Scalable camera technology and switchable resolution (OnDemandHR)
  • Best resolution at angled views
  • Reliable 01005 and fine-pitch inspection
  • Reading data matrix code, bottom up
  • Throughput burst as add-on
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Lead-free technology fully supported
  • Tried and tested comprehensive IPC-compliant Viscom inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Insufficient solderExcessive solderMissing solder
Solder bridge/short circuitTombstoneLifted lead
Soldering errorNon-WettingContamination
Missing componentPolarityMisplaced component
X placementY placementRotation
Broken componentWrong componentFlipped component
BillboardingBent leadDamaged lead
Excess componentForm defect
Optional:
Surface inspectionCircumference defectsElectronic color codes
OCRBlow holesSolder balls/splash
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer
  • Preparation, storage and printing of error logs
  • Automated grayscale value calibration to ensure consistent inspection results
  • Flexible single- and multi-line utilization of the verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
Specifications

Application

Placement and solder joint inspection
(reflow and wave soldering)

Camera technology

Orthogonal camera module 8M (white LEDs):
Field of view: 57.6 x 43.5 mm (2.3" x 1.7")
Resolution: 23.5 µm (standard), 11.75 µm (high) switchable 
with OnDemandHR
Number of megapixel cameras: 4

Angular view camera module 8M (white LEDs):
Resolution: 16.1 µm (standard), 8.05 µm (high) switchable 
with OnDemandHR
Number of megapixel cameras: 4

Software

User interface: Viscom EasyPro/vVision
SPC: Viscom SPC (statistical process control),
open interface (option)
Verification station: Viscom vVerify/HARAN
Remote diagnosis: Viscom SRC (software remote control) 
(option)
Programming station: Viscom PST34 (option)

System computer

Operating system: Windows®
Processor: Intel® CoreTM i7

PCB handling

PCB dimensions: 508 x 508 mm (20" x 20") 
Transport height: 900 to 950 mm ± 20 mm (35.4" x 37.4" 0.8")
Width adjustment: Automatic
Transport concept: Single track transport
PCB clamping: Pneumatic
Upper transport clearance: 35 mm (1.4") 
Lower transport clearance: Up to 60 mm (2.4")

Inspection speed

20 – 40 cm2/s

Other system data

Positioning/handling unit: Synchronous linear motors
Interfaces: SMEMA
Power requirements: 230 V, 50/60 Hz, 1P/N/PE, consumption 0.35 kW, 
compressed air 6 bar (90 psi)
System dimensions: 994 mm x 1565 mm x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D)
Weight: 600 kg (1323 lbs)

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