S3088 DT – Dual Track 3D AOI

  • Technology – High throughput, peak performance camera technology
  • Inspection depth – 2D / 2.5D and 3D inspection with up to 8 angled views
  • Variant diversity – SPI, AOI, CCI and UFI camera configuration options
  • Versatility – Double or single track systems possible
  • Networking – Complete connection to cutting-edge Industry 4.0 interfaces
  • Footprint – Integrated monitor for reduced system dimensions


  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Lead-free technology fully supported
  • Tried and tested comprehensive IPC-compliant Viscom inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
    Defect coverage

    Post Reflow 

    Insufficient solderExcessive solderMissing solder
    Solder bridge, short circuitTombstoneLifted lead
    Soldering errorNon-wettingContamination
    Missing componentPolarityMisplaced component
    X placementY placementRotation
    Broken componentWrong componentFlipped component
    BillboardingBent leadDamaged lead
    Excess componentForm defect
    Surface inspectionCircumference defectsElectronic color codes
    OCRVOIDsSolder balls/splash




    • Individually configurable high performance optical camera technology (SPI, AOI, CCI, UFI)
    • Connection to horizontal interfaces along the production line
      • Viscom Quality Uplink – Intelligent networking of Viscom inspection systems along the production line
      • Viscom Closed Loop – Intelligent communication of Viscom inspection systems with paste printers and placement machines
      • Production line control and product traceability
      • Flexible integration of additional production-relevant modules: buffers, label printers, etc.
    • Connection to vertical interfaces for communication with MES systems
    • Flexible single- or multi-line verification solutions
    • Statistical process control Viscom SPC / vSPC
    • Offline programming stations for increased efficiency
    Inspection scope3D AOISolder joints, placement, solder paste
    Camera technology3D camera technology
    Z-resolution0.5 μm
    Z-rangeUp to 30 mm (1.2")
    Angled view cameras
    Number of megapixel cameras8
    Orthogonal camera
    Resolution10 μm
    Field of view50 mm x 50 mm (2" x 2")
    User interfaceViscom EasyPro/vVision-ready
    SPC Viscom SPC, open interface (optional)
    Verification stationViscom vVerify/HARAN
    Remote diagnosis

    Viscom SRC (software remote control) (optional)

    Programming stationViscom PST34 (optional)
    System computer
    Operating systemWindows®
    ProcessorIntel® Core™ i7
    PCB handling
    Transport typeDual-track transport
    PCB dimensions (L x W)450 mm x 350 mm (17.7" x 13.8"), minimum width 70 mm (2.8")
    Transport height900 - 950 mm ± 20 mm (35.4" - 37.4" ± 0.8")
    Width adjustmentAutomatic
    PCB clampingPneumatic
    Upper transport clearance50 mm (2")
    Lower transport clearance40 mm (1.6")**
    Inspection speed Up to 65 cm²/s
    Other system data
    Positioning/handling unitSynchronous linear motors
    Power requirements400 V (other voltages on request), 3P/N/PE, 8 A,
    compressed air max. 10 bar (working pressure 4 - 6 bar)
    System dimensions1094 mm x 1565 mm x 1692 mm (43.1" x 61.6" x 66.6") (W x H x D)
    Weight1400 kg (3086 lbs)

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