S3088 ultra – High-Speed 3D AOI

S3088 ultra gold

Features

Very reliable high-speed 3D inspection for soldered connections

Extremely fast AOI camera system
Scalable, modular camera technology with 3D measuring function
Greatest inspection depth: reliable inspection of 03015 and fine-pitch components
Maximum fault coverage - 9 views plus 3D measurement
Best resolution at angled views
Height measurement of components
Extremely high throughput due to FastFlow Handling
Fast program generation with vVision/EasyPro
Reading DataMatrix code, bottom up

Viscom-Plus

Reliable inspection program optimization through integrated verification
Global libraries, global calibration: Transferability to all systems
Traceability, SPC, verification, off-line programming and much more
Robust inspection strategies using the Viscom standard library for solder joint inspections
Inspection in the shortest cycle time
Lead-free technology fully supported
Successful comprehensive IPC-conformant inspection library
Customer-specific software adaptation
User interface in nearly every language
Viscom Quality Uplink for optimization of the entire process
Complete statistical process analysis
Independent real-time image processing with Viscom analysis tools
High-performance OCR software
Over 30 years of AOI experience included

Defect coverage

Not enough solder	Too much solder	Missing solder
Solder bridging/short circuit	Tombstone effect	Lifted lead
Solder defects	Solderability	Contamination
Missing component	Polarity error	Component displaced
Rotation	Component damaged	Incorrect component
Face down component	Component on its side	Twisted pin
Damaged pin	Component equipped too much	Form defects

Optional:
Open area analysis	Wobble circle error	Color ring analysis
OCR	Air holes in the soldered connection	Solder ball/solder spray

Options

Specifications

		S3088 ultra	S3088 ultra gold
Inspection scope
	Solder joints, placement, solder paste
Camera technology		XM	XMplus
	Total number of megapixels	Up to 65	Up to 121
	3D sensor technology
	- Z-resolution	0.5 µm
	- Range	Up to 30 mm (1.2")
	- Lateral resolution	16 µm	10 µm
	Angular view cameras
	- Number of cameras	4 (8, optional)	8
	Orthogonal camera
	- Resolution	8 µm	10 µm
	- Field of view	40 mm x 40 mm (1.6" x 1.6")	50 mm x 50 mm (2" x 2")
Inspection speed
		Up to 50 cm²/s	Up to 65 cm²/s
Software
	User interface	Viscom vVision/EasyPro
	SPC	Viscom SPC (statistical process control), open interface (optional)
	Verification station	Viscom vVerify/HARAN
	Remote diagnosis	Viscom SRC (software remote control) (optional)
	Programming station	Viscom PST34 (optional)
System computer
	Operating system	Windows®
	Processor	Intel® Core™ i7
PCB handling
	PCB dimensions	508 mm x 508 mm (20" x 20")
	PCB support	Optional
	Transport height	850 - 950 mm ± 20 mm (33.5" - 37.4" ± 0.8")
	Width adjustment	Automatic
	Transport concept	Single track transport
	PCB clamping	Pneumatic
	Upper transport clearance	50 mm (2")
	Lower transport clearance	Up to 85 mm (3.4"), 40 mm (1.6") with PCB support
Other system data
	Positioning/handling unit	Synchronous linear motors
	Interfaces	SMEMA, SV70
	Power requirements	400 V (other voltages on request), 3P/N/PE, 8 A
	System dimensions	997 mm x 1600 mm x 1540 mm (39.3" x 63" x 60.6") (W x H x D)
	Weight	Max. 800 kg (1764 lbs)