S3088 ultra blue – 3D AOI
Price-performance champion
Convincing 3D AOI for the inspection of soldered connections
- Extremely fast AOI camera system
- Optimal camera technology for 2/2.5/3D requirements
- Greatest inspection depth: reliable inspection of 03015 und fine-pitch components
- Best resolution at angled views
- Height measurement of components
- Revolutionary simplicity in AOI operation with vVision
- Fast program generation with vVision/EasyPro
- Reading DataMatrix code, bottom up
- Reliable inspection program optimization through integrated verification
- Global libraries, global calibration: Transferability to all systems
- Traceability, SPC, verification, off-line programming and much more
- Robust inspection strategies using the Viscom standard library for solder joint inspections
- Inspection in the shortest cycle time
- Lead-free technology fully supported
- Successful comprehensive IPC-conformant inspection library
- Customer-specific software adaptation
- User interface in nearly every language
- Viscom Quality Uplink for optimization of the entire process
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 30 years of AOI experience included
Not enough solder | Too much solder | Missing solder |
Solder bridging/short circuit | Tombstone effect | Lifted lead |
Solder defects | Solderability | Contamination |
Missing component | Polarity error | Component displaced |
Rotation | Component damaged | Incorrect component |
Face down component | Component on its side | Twisted pin |
Damaged pin | Component equipped too much | Form defects |
Optional: | ||
Open area analysis | Wobble circle error | Color ring analysis |
OCR | VOIDs in the soldered connection | Solder ball/solder spray |
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Control of label printers and bad-board markers
- Intelligent FIFO buffer control
- Preparation, storage, and printing of error logs
- Automated grayscale value calibration for constant inspection results
- Flexible single and multi-line use of verification and repair station
- Management monitoring through Viscom SPC
- User-friendly real image display providing better verification
- Long Board Option for longer PCBs available
Inspection scope | Solder joints, placement, solder paste |
Sensor technology | Orthogonal camera module XM: Angled view camera module XM: XM 3D sensor technology: |
Software | User interface: Viscom vVison/EasyPro |
System computer | Operating system: Windows® |
PCB handling | PCB dimensions: 508 mm x 508 mm (20" x 20") |
Inspection speed | 30–50 cm2/s |
Other system data | Interfaces: SMEMA |