S3088 ultra blue – 3D AOI

Price-performance champion


Convincing 3D AOI for the inspection of soldered connections

  • Extremely fast AOI camera system
  • Optimal camera technology for 2/2.5/3D requirements
  • Greatest inspection depth: reliable inspection of 03015 und fine-pitch components
  • Best resolution at angled views
  • Height measurement of components
  • Revolutionary simplicity in AOI operation with vVision
  • Fast program generation with vVision/EasyPro
  • Reading DataMatrix code, bottom up
  • Reliable inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Inspection in the shortest cycle time
  • Lead-free technology fully supported
  • Successful comprehensive IPC-conformant inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Viscom Quality Uplink for optimization of the entire process
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Not enough solderToo much solderMissing solder
Solder bridging/short circuitTombstone effectLifted lead
Solder defectsSolderabilityContamination
Missing componentPolarity errorComponent displaced
RotationComponent damagedIncorrect component
Face down componentComponent on its sideTwisted pin
Damaged pinComponent equipped too much Form defects
Open area analysisWobble circle errorColor ring 
OCRVOIDs in the
soldered connection
Solder ball/solder spray
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, storage, and printing of error logs
  • Automated grayscale value calibration for constant inspection results
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
  • Long Board Option for longer PCBs available

Inspection scope

Solder joints, placement, solder paste
Sensor technology

Orthogonal camera module XM:
Field of view: 40 mm x 40 mm (1.57" x 1.57")
Resolution: 8 μm
Number of megapixel cameras: 1

Angled view camera module XM:
Resolution: 16 µm 
Number of megapixel cameras: 4

XM 3D sensor technology:
Range: Up to 30 mm (1.18")
Z resolution: 0.5 μm


User interface: Viscom vVison/EasyPro
SPC: Viscom SPC (statistical process control), open interface (option)
Verification station: Viscom vVerify/HARAN
Remote diagnosis: Viscom SRC (software remote control) (option)
Programming station: Viscom PST34 (option)

System computer

Operating system: Windows®
Processor: Intel® CoreTM i7

PCB handling

PCB dimensions: 508 mm x 508 mm (20" x 20") 
Transport height: 850-950 mm ± 20 mm (33.5"-37.4" ± 0.8")
Width adjustment: Automatic
Positioning unit: Synchronous linear motor
Transport type: Single track transport
PCB clamping: Pneumatic
Upper transport clearance: 50 mm (2") 
Lower transport clearance: 50 mm (2") 

Inspection speed

30–50 cm2/s

Other system data

Interfaces: SMEMA
Power requirements: 400 V (other voltages on request), 3P/N/PE, 15 A
System dimensions: 994 x 1565 x 1349 mm  (39.1" x 61.6" x 53.1") (W x H x D) 
Weight: 800 kg (1764 lbs)

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