S3088 ultra blue – 3D AOI

Price-performance champion

Features

Convincing 3D AOI for the inspection of soldered connections

Extremely fast AOI camera system
Optimal camera technology for 2/2.5/3D requirements
Greatest inspection depth: reliable inspection of 03015 und fine-pitch components
Best resolution at angled views
Height measurement of components
Revolutionary simplicity in AOI operation with vVision
Fast program generation with vVision/EasyPro
Reading DataMatrix code, bottom up

Viscom-Plus

Reliable inspection program optimization through integrated verification
Global libraries, global calibration: Transferability to all systems
Traceability, SPC, verification, off-line programming and much more
Robust inspection strategies using the Viscom standard library for solder joint inspections
Inspection in the shortest cycle time
Lead-free technology fully supported
Successful comprehensive IPC-conformant inspection library
Customer-specific software adaptation
User interface in nearly every language
Viscom Quality Uplink for optimization of the entire process
Complete statistical process analysis
Independent real-time image processing with Viscom analysis tools
High-performance OCR software
Over 30 years of AOI experience included

Defect coverage

Not enough solder	Too much solder	Missing solder
Solder bridging/short circuit	Tombstone effect	Lifted lead
Solder defects	Solderability	Contamination
Missing component	Polarity error	Component displaced
Rotation	Component damaged	Incorrect component
Face down component	Component on its side	Twisted pin
Damaged pin	Component equipped too much	Form defects

Optional:
Open area analysis	Wobble circle error	Color ring analysis
OCR	Air holes in the soldered connection	Solder ball/solder spray

Options

Specifications

Inspection scope	Solder joints, placement, solder paste
Sensor technology	Orthogonal camera module XM: Field of view: 40 mm x 40 mm (1.57" x 1.57") Resolution: 8 μm Number of megapixel cameras: 1 Angled view camera module XM: Resolution: 16 µm Number of megapixel cameras: 4 XM 3D sensor technology: Range: Up to 30 mm (1.18") Z resolution: 0.5 μm
Software	User interface: Viscom vVison/EasyPro SPC: Viscom SPC (statistical process control), open interface (option) Verification station: Viscom vVerify/HARAN Remote diagnosis: Viscom SRC (software remote control) (option) Programming station: Viscom PST34 (option)
System computer	Operating system: Windows® Processor: Intel® Core^TM i7
PCB handling	PCB dimensions: 508 mm x 508 mm (20" x 20") Transport height: 850-950 mm ± 20 mm (33.5"-37.4" ± 0.8") Width adjustment: Automatic Positioning unit: Synchronous linear motor Transport type: Single track transport PCB clamping: Pneumatic Upper transport clearance: 50 mm (2") Lower transport clearance: 50 mm (2")
Inspection speed	30–50 cm²/s
Other system data	Interfaces: SMEMA Power requirements: 208 V (other voltages on request), 3P/N/PE, 15 A System dimensions: 994 x 1565 x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D) Weight: 800 kg (1764 lbs)