S6056 – High-End 3D AOI


The long-term inspection solution for wave, reflow, pre-reflow and selective soldering

  • Extremely fast AOI XM 3D camera system
  • Scalable, modular high performance camera technology with 3D measuring function
  • Maximum inspection depth: 03015 components
  • Best resolution at angled views
  • Height measurement of components
  • Single- or double-track operation
  • Also supports larger printed circuit boards
  • Fast program generation with vVision/EasyPro
  • Maximum inspection program optimization through integrated verification
  • Robust short-cycle inspections
  • Global libraries, global calibration: Transferability to all systems
  • Simple, fast operation and inspection program generation with EasyPro/vVision-ready
  • Traceability, SPC, verification, off-line programming, and much more
  • Lead-free technology fully supported
  • Tried and tested comprehensive IPC-compliant Viscom inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Insufficient solderExcessive solderMissing solder
Solder bridge, short circuitTombstoneLifted lead
Soldering errorNon-wettingContamination
Missing componentPolarityMisplaced component
X placementY placementRotation
Broken componentWrong componentFlipped component
BillboardingBent leadDamaged lead
Excess componentForm defect
Surface inspectionCircumference defectsElectronic color codes
OCRVOIDsSolder balls/splash
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer control
  • Automated grayscale value calibration to ensure consistent inspection results
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the classification station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
  • XM ultra high-speed camera technology

Solder joint, assembly, solder paste

Transport system

S6056 ST1W: Single track
S6056 DS1W: Dual track

Inspection concept

S6056 ST1W: Single inspection
S6056 DS1W: Single inspection

Camera technology

XM 3D camera technology:
Range: Up to 30 mm (1.2")
Z-resolution: 0.5 µm

XM module - angled view cameras:
Resolution: 16 µm (standard)
Number of megapixel cameras: 4/8(optional)

XM module - orthogonal camera:
Field of view: 40 mm x 40 mm (1.57" x 1.57")
Resolution: 16 μm (standard), 8 μm (high) switchable with OnDemandHR
Number of megapixel cameras: 1

XMplus/8M camera technology (optional)


User interface:
ST1W: Viscom vVision/EasyPro; DS1W: Viscom EasyPro/vVision-ready
Verification station: ST1W: Viscom vVerify/HARAN; DS1W: Viscom HARAN
SPC: Viscom SPC (statistical process control), open interface (optional)
Remote diagnosis: Viscom SRC (optional)
Off-line programming: Viscom PST34
(external programming station) (optional)

System computer

Operating system: Windows®
Processor: Intel® Core™ i7

PCB handling

PCB dimensions (L x W): 457 mm x 356 mm (17.9" x 14.0")
(Specification of the DS1W version, other sizes optional)
PCB carrier: 1 - 5 mm (0.04" - 0.2") (lower thicknesses optional)
Transport height: 850 - 960 mm ± 20 mm (33.5" to 37.8" ± 0.8")
Width adjustment: Automatic
PCB clamping: Pneumatic
PCB contact area: 3 mm (0.1")
Upper transport clearance: 50 mm (1.9")
Lower transport clearance: 40 mm (1.6") (other hights upon request)

Inspection speed

Up to 65 cm²/s, minimized handling time

Other system data

Positioning/handling unit: Synchronous linear motors
Interfaces: SMEMA, SV70, customer specific
Power requirements: 400 V (other voltages on request), 3P/N/PE, 8 A, 4-6 bar working pressure
System dimensions: 1528 mm x 1650 mm x 1692 mm (60.2" x 65.0" x 66.7") (W x H x D)
Weight (max.): 1700 kg (3747 lbs)




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