S3088 SPI – 3D SPI

Features

Reliable 3D SPI with Quality Uplink, process control and DualView

Precise control of all essential 3D features; calibration-free
Extremely high throughput due to FastFlow Handling
Integrated height tracking
Viscom Quality Uplink: process optimization and first-pass yield increase
Simple process analysis with the Viscom Uplink Analyzer
Fast program generation
Print optimization through interlinkage with printer (closed loop)

Viscom-Plus

Maximum inspection program optimization through integrated verification
Robust short-cycle inspections
Global libraries, global calibration: Transferability to all systems
Simple operation and inspection program generation with EasyPro/vVision-ready
Traceability, SPC, verification, off-line programming and much more
Customer-specific software adaptation
User interface in nearly every language
Complete statistical process analysis
Independent real-time image processing with Viscom analysis tools
High-performance OCR software
Simple process analysis with the Viscom Uplink Analyzer
Over 30 years of AOI experience included

Defect coverage

Insufficent solder	Excessive solder	Missing solder
Solder bridge/short circuit	Contamination	Offset print
Smearing of paste	Paste shape defect	X placement
Y placement	Rotation	Form defect
Optional:
Surface inspection	OCR

Options

Freely configurable interfaces to connect various modules
Communication with MES systems
Label printers and bad board markers control
Intelligent FIFO buffer control
Preparation, storage and printing of error logs
Flexible single- and multi-line utilization of the verification and repair station
Management monitoring through Viscom SPC
User-friendly real image display providing a better verification

Specifications

		S3088 SPI	S3088 SPI DualView
Application		3D solder paste inspection	3D solder paste inspection
Camera technology	Measurement method	Fringe projection process	Fringe projection process
	Pixel size	15 µm	15 µm
Software	User interface	Viscom vVision/EasyPro	Viscom vVision/EasyPro
	SPC	Viscom SPC (statistical process control), open interface (option)	Viscom SPC (statistical process control), open interface (option)
	Verification station	Viscom HARAN	Viscom HARAN
	Remote diagnosis	Viscom SRC (option)	Viscom SRC (option)
	Programming station	Viscom PST34 (option)	Viscom PST34 (option)
System computer	Operating system	Windows®	Windows®
	Processor	Intel® Core™ i7	Intel® Core™ i7
Performance data
Measurement specifications	Repeatability Height evaluation	< 1 % @ 3 σ (on certification target)	<< 1 % @ 3 σ (on certification target)
	Repeatability Volume evaluation	< 3 % @ 3 σ (on paste)	<< 3 % @ 3 σ (on paste)
	Gage R&R Volume evaluation	<< 10 % @ 6 σ (on paste) << 5 % @ 6 σ (on certification target)	<< 5 % @ 6 σ (on paste) << 2 % @ 6 σ (on certification target)
	Height measurement accuracy	2 µm (on certification target)	2 µm (on certification target)
Paste	Paste area min.	150 μm x 150 μm	100 μm x 100 μm
	Paste area max.	15 mm x 15 mm (0.6" x 0.6")	15 mm x 15 mm (0.6" x 0.6")
	Paste height min./max.	50 μm/500 μm	50 μm/500 μm
PCB handling	PCB dimensions max.	508 mm x 508 mm (20" x 20")	450 mm x 508 mm (17.7" x 20") (L x W)
	PCB dimensions min.	50 x 50 mm (2" x 2")	50 x 50 mm (2" x 2")
	PCB support	Option	Option
	Transport height	850 - 950 mm ± 20 mm (33.5" - 37.4")	850 - 950 mm ± 20 mm (33.5" - 37.4")
	Width adjustment	Automatic	Automatic
	Transport concept	Single track transport	Single track transport
	PCB clamping	Pneumatic	Pneumatic
	Upper transport clearance	35 mm (1.1")	35 mm (1.1")
	Lower transport clearance	50 mm (2"), up to 85 mm (3.4") (optional), 40 mm (1.6") with PCB support	50 mm (2"), up to 85 mm (3.4") (optional), 40 mm (1.6") with PCB support
Inspection speed (Standard)		Up to 80 cm²/s (HighRes 15 µm) Up to 200 cm²/s (HighSpeed 30 μm)	Up to 80 cm²/s (HighRes 15 μm) Up to 200 cm²/s (HighSpeed 30 μm)
Inspection speed (DualView)		-	Up to 40 cm²/s (HighRes 15 µm) Up to 80 cm²/s (HighSpeed 30 µm)
Other system data	Positioning/handling unit	Synchronous linear motors	Synchronous linear motors
	Interfaces	SMEMA, SV70	SMEMA, SV70
	Power requirements	400 V (other voltages on request), 3P/N/PE, 8 A	400 V (other voltages on request), 3P/N/PE, 8 A
	System dimensions	997 mm x 1600 mm x 1540 mm (39.3" x 63" x 60.6") (W x H x D)	997 mm x 1600 mm x 1540 mm (39.3" x 63" x 60.6") (W x H x D)
	Weight max.	750 kg (1653 lbs)	750 kg (1653 lbs)