S3088 SPI – 3D SPI
Features
Reliable 3D SPI with Quality Uplink, process control and DualView
- Precise control of all essential 3D features; calibration-free
- Extremely high throughput due to FastFlow Handling
- Integrated height tracking
- Viscom Quality Uplink: process optimization and first-pass yield increase
- Simple process analysis with the Viscom Uplink Analyzer
- Fast program generation
- Print optimization through interlinkage with printer (closed loop)
Viscom-Plus
- Maximum inspection program optimization through integrated verification
- Robust short-cycle inspections
- Global libraries, global calibration: Transferability to all systems
- Simple operation and inspection program generation with EasyPro/vVision-ready
- Traceability, SPC, verification, off-line programming and much more
- Customer-specific software adaptation
- User interface in nearly every language
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Simple process analysis with the Viscom Uplink Analyzer
- Over 30 years of AOI experience included
Defect coverage
Insufficent solder | Excessive solder | Missing solder |
Solder bridge/short circuit | Contamination | Offset print |
Smearing of paste | Paste shape defect | X placement |
Y placement | Rotation | Form defect |
Optional: | ||
Surface inspection | OCR |
Options
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Label printers and bad board markers control
- Intelligent FIFO buffer control
- Preparation, storage and printing of error logs
- Flexible single- and multi-line utilization of the verification and repair station
- Management monitoring through Viscom SPC
- User-friendly real image display providing a better verification
- Long Board Option for longer PCBs available
Specifications
S3088 SPI | S3088 SPI DualView | ||
Application | 3D solder paste inspection | 3D solder paste inspection | |
Camera technology | Measurement method | Fringe projection process | Fringe projection process |
Pixel size | 15 µm | 15 µm | |
Software | User interface | Viscom vVision/EasyPro | Viscom vVision/EasyPro |
SPC | Viscom SPC (statistical process control), open interface (option) | Viscom SPC (statistical process control), open interface (option) | |
Verification station | Viscom HARAN | Viscom HARAN | |
Remote diagnosis | Viscom SRC (option) | Viscom SRC (option) | |
Programming station | Viscom PST34 (option) | Viscom PST34 (option) | |
System computer | Operating system | Windows® | Windows® |
Processor | Intel® Core™ i7 | Intel® Core™ i7 | |
Performance data | |||
Measurement specifications | Repeatability Height evaluation | < 1 % @ 3 σ (on certification target) | << 1 % @ 3 σ (on certification target) |
Repeatability Volume evaluation | < 3 % @ 3 σ (on paste) | << 3 % @ 3 σ (on paste) | |
Gage R&R Volume evaluation | << 10 % @ 6 σ | << 5 % @ 6 σ (on paste) << 2 % @ 6 σ (on certification target) | |
Height measurement accuracy | 2 µm (on certification target) | 2 µm (on certification target) | |
Paste | Paste area min. | 150 μm x 150 μm | 100 μm x 100 μm |
Paste area max. | 15 mm x 15 mm (0.6" x 0.6") | 15 mm x 15 mm (0.6" x 0.6") | |
Paste height min./max. | 50 μm/500 μm | 50 μm/500 μm | |
PCB handling | PCB dimensions max. | 508 mm x 508 mm (20" x 20") | 450 mm x 508 mm (17.7" x 20") (L x W) |
PCB dimensions min. | 50 x 50 mm (2" x 2") | 50 x 50 mm (2" x 2") | |
PCB support | Option | Option | |
Transport height | 850 - 950 mm ± 20 mm (33.5" - 37.4") | 850 - 950 mm ± 20 mm (33.5" - 37.4") | |
Width adjustment | Automatic | Automatic | |
Transport concept | Single track transport | Single track transport | |
PCB clamping | Pneumatic | Pneumatic | |
Upper transport clearance | 35 mm (1.1") | 35 mm (1.1") | |
Lower transport clearance | 50 mm (2"), up to 85 mm (3.4") (optional), 40 mm (1.6") with PCB support | 50 mm (2"), up to 85 mm (3.4") (optional), 40 mm (1.6") with PCB support | |
Inspection speed (Standard) | Up to 80 cm²/s (HighRes 15 µm) Up to 200 cm²/s (HighSpeed 30 μm) | Up to 80 cm²/s (HighRes 15 μm) Up to 200 cm²/s (HighSpeed 30 μm) | |
Inspection speed (DualView) | - | Up to 40 cm²/s (HighRes 15 µm) Up to 80 cm²/s (HighSpeed 30 µm) | |
Other system data | Positioning/handling unit | Synchronous linear motors | Synchronous linear motors |
Interfaces | SMEMA, SV70 | SMEMA, SV70 | |
Power requirements | 400 V (other voltages on request), | 400 V (other voltages on request), 3P/N/PE, 8 A | |
System dimensions | 997 mm x 1600 mm x 1540 mm (39.3" x 63" x 60.6") (W x H x D) | 997 mm x 1600 mm x 1540 mm | |
Weight max. | 750 kg (1653 lbs) | 750 kg (1653 lbs) |