S6056BO – Inline AOI
High-performance automatic in-line wire bond inspection for high throughput
- Precise, reliable inspection down to wire diameters of 17 µm
- Reliable detection of defective wire paths, dies and component position
- Combined inspection of wire bonds and SMD placement
- Secure detection of damaged and misplaced components
- Inspection of conductive adhesive bond
- Reliable inspection of larger inspection objects
- Individually adaptable inspection scope
- Simple operation and inspection program generation with EasyPro
- Possible to read data matrix code from program flow
- Ideal for single and double track operation
- Fast image capture process and short analysis times
- High-power inspection algorithms for all typical wire bond processes
- In-line capability enables inspection of rapid throughput
- Compatible with all Viscom bond camera modules
- Simple operation and inspection program generation with EasyPro
- Traceability, SPC, verification, off-line programming and much more
- Lead-free technology fully supported
- Customer-specific software adaptations
- Customer-specific transport concepts possible
- User interface available in multiple languages
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 20 years bond experience included
- Over 30 years AOI experience included
| Missing component | Missing ball/stitch | Missed solder joint |
| Slanted component (tilt) | Ball/stitch position out of tolerance | Insufficient solder |
| Face down component | Ball/stitch geometry deviation | Solder bridging/short circuit, general solder defects |
| Tombstoning | "Golf club" | Nonwetting |
| Contaminated component | Contaminated pad | Missing conductive adhesive |
| X/Y component displacement | Missing wedge | Conductive adhesive residue |
| Component rotation out of tolerance | Wedge rotation out of tolerance | |
| Damaged component | Wedge geometry deviation | |
| Incorrect component | Wedge position out of tolerance | |
| Excess components | Contaminated land, capillary imprint | |
| Component on its side | Missing wire | |
| Twisted lead | Defective wire course | |
| Damaged lead | Not enough clearance to adjacent wires, short circuit | |
| Lifted lead | ||
| Reversed polarity | ||
| THT hole fill | ||
| Void | ||
| Scratched chip surface | ||
| Edge chipping | ||
| Optional: | ||
| Open area analysis | Wobble circle error | Electronic color code analysis |
| OCR | Blow holes in the solder joint | Solder ball/solder sputter |
| Coplanarity inspection |
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Control of label printers and bad-board markers
- Intelligent FIFO buffer control
- Automated grayscale value calibration for constant inspection results
- Preparation, filing, and printing of defect logs
- Flexible single and multi-line use of verification and repair station
- Management monitoring through Viscom SPC
- User-friendly real image display providing better verification
- XM ultra-high-speed camera technology
| Application | Ball-bond, wedge-bond, wire, die/SMD, ribbon |
| Camera technology | XM HR bond module: |
| Software | User interface: Viscom EasyPro |
| System computer | Operating system: Windows® |
| Substrate handling | Substrate dimensions: Transport height: 860 - 1180 mm ± 20 mm (33.86" - 46.46" ± 0.79") |
| Inspection speed | Up to 65 cm²/s, minimized handling time |
| Other system data | Interfaces: SMEMA, SV70, customer-specific |
