S6056BO – Inline AOI

Features

High-performance automatic in-line wire bond inspection for high throughput

Viscom-Plus

Fast image capture process and short analysis times
High-power inspection algorithms for all typical wire bond processes
In-line capability enables inspection of rapid throughput
Compatible with all Viscom bond camera modules
Simple operation and inspection program generation with EasyPro/vVision (S6056BO DS2W: EasyPro/vVision-ready)
Traceability, SPC, verification, off-line programming and much more
Lead-free technology fully supported
Customer-specific software adaptations
Customer-specific transport concepts possible
User interface available in multiple languages
Complete statistical process analysis
Independent real-time image processing with Viscom analysis tools
High-performance OCR software
Over 20 years bond experience included
Over 30 years AOI experience included

Defect coverage

Missing component	Missing ball/stitch	Missed solder joint
Slanted component (tilt)	Ball/stitch position out of tolerance	Insufficient solder
Face down component	Ball/stitch geometry deviation	Solder bridging/short circuit, general solder defects
Tombstoning	"Golf club"	Nonwetting
Contaminated component	Contaminated pad	Missing conductive adhesive
X/Y component displacement	Missing wedge	Conductive adhesive residue
Component rotation out of tolerance	Wedge rotation out of tolerance
Damaged component	Wedge geometry deviation
Incorrect component	Wedge position out of tolerance
Excess components	Contaminated land, capillary imprint
Component on its side	Missing wire
Twisted lead	Defective wire course
Damaged lead	Not enough clearance to adjacent wires, short circuit
Lifted lead
Reversed polarity
THT hole fill
Void
Scratched chip surface
Edge chipping
Optional:
Open area analysis	Wobble circle error	Electronic color code analysis
OCR	Blow holes in the solder joint	Solder ball/solder sputter
Coplanarity inspection

Options

Specifications

Application	Ball-bond, wedge-bond, wire, die/SMD. ribbon
Camera technology	Ultra-high resolution VHR module: Number of modules per machine: Typical 1 Number of mega pixel cameras: 1 Pixel size: Typical 5 μm/pixel or 2.5 μm/pixel Further cameras available on request Standard module 8M-1SRWBond: Number of modules per machine: Typical 1 Number of mega pixel cameras: 1 Pixel size: Typical 10 μm/pixel Further cameras available on request
Software	User interface: Viscom EasyPro SPC: Viscom SPC (statistical process control), open interface (option) Verification station: Viscom HARAN Remote diagnosis: Viscom SRC (option) Programming station: Viscom PST34 (option)
System computer	Operation system: Windows® Processor: Intel® Core™ i7
Substrate handling	Substrate dimensions: Single-track: 152 x 127 mm (6.0" x 5.0") (L x W) Dual-track: 290 x 200 mm (11.4" x 7.9") (L x W) Further dimensions on request Transport height: 860 - 1180 mm ± 20 mm (33.86" - 46.46" ± 0.79") Substrate fixing: Vacuum or mechanical clamping Upper transport clearance: 15/35 mm (depending on camera technology − other camera options available on request)
Inspection speed	up to 65 cm²/s, minimized handling time
Other system data	Interfaces: SMEMA, SV70, customer-specific Power requirements: 400 V (other voltages on request), 3 P/N/PE, 8 A System dimensions: 1100 x 1650 x 1692 mm (43.3" x 65" x 66.6") (W x D x H) Weight: 1700 kg (3748 lbs)