S6056BO – Inline AOI


High-performance automatic in-line wire bond inspection for high throughput

  • Precise, reliable inspection down to wire diameters of 17 µm 
  • Reliable detection of defective wire paths, dies and component position
  • Combined inspection of wire bonds and SMD placement
  • Secure detection of damaged and misplaced components
  • Inspection of conductive adhesive bond
  • Reliable inspection of larger inspection objects
  • Individually adaptable inspection scope
  • Simple operation and inspection program generation with EasyPro
  • Possible to read data matrix code from program flow
  • Ideal for single and double track operation
  • Fast image capture process and short analysis times
  • High-power inspection algorithms for all typical wire bond processes
  • In-line capability enables inspection of rapid throughput
  • Compatible with all Viscom bond camera modules
  • Simple operation and inspection program generation with EasyPro
  • Traceability, SPC, verification, off-line programming and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptations
  • Customer-specific transport concepts possible
  • User interface available in multiple languages
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 20 years bond experience included
  • Over 30 years AOI experience included
Defect coverage
Missing componentMissing ball/stitchMissed solder joint
Slanted component (tilt)Ball/stitch position out of toleranceInsufficient solder
Face down componentBall/stitch geometry deviationSolder bridging/short circuit,
general solder defects
Tombstoning"Golf club"Nonwetting
Contaminated componentContaminated padMissing conductive adhesive
X/Y component displacementMissing wedgeConductive adhesive residue
Component rotation out of toleranceWedge rotation out of tolerance
Damaged componentWedge geometry deviation
Incorrect componentWedge position out of tolerance
Excess componentsContaminated land, capillary imprint
Component on its sideMissing wire
Twisted leadDefective wire course
Damaged leadNot enough clearance to adjacent wires, short circuit
Lifted lead
Reversed polarity
THT hole fill
Scratched chip surface
Edge chipping
Open area analysisWobble circle errorElectronic color code analysis
OCRVOIDs in the solder jointSolder ball/solder sputter
Coplanarity inspection
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Automated grayscale value calibration for constant inspection results
  • Preparation, filing, and printing of defect logs
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
  • XM ultra-high-speed camera technology
Transport system Single track Double trackDual shuttle
Inspection conceptSingle inspection
Inspection scopeBondBall bond, wedge bond, wire, die/SMD, ribbon
Camera technology

Standard configuration
XM Bond HR*


Number of modules per machine:


Number of cameras:


Pixel size:

4.5 μm/pixel


User Interface: 

Viscom EasyPro

SPC:Viscom SPC (statistical process control), open interface (optional)
Verification station:Viscom HARAN
Remote diagnosis:Viscom SRC (software remote control) (optional)
Programming station:Viscom PST34 (optional)
System computerOperating system:Windows®
Processor:Intel® Core™ i7
Substrate handlingMax. substrate size:300 mm x 400 mm
(11.8" x 15.7") (L x W)*
290 mm x 200 mm
(11.4" x 7.9") (L x W)*
Transport clearance:860 - 1180 mm ± 20 mm (33.9" - 46.5" ± 0.8")
Substrate clamping:Vacuum or mechanical clamping
Upper transport clearance:Up to 35 mm (1.4")
Inspection speedUp to 65 cm2/s, minimized handling time
Other system dataPositioning/handling unit:Synchronous linear motors
Interfaces:SMEMA, SV70, customer-specific
Power requirements:400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure
System dimensions:1100 mm x 1650 mm x 1692 mm (43.3" x 65" x 66.6") (W x H x D)
Weight:1700 kg (3748 lbs)


 *Other camera technologies and substrate sizes on request



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