Combined AOI/AXI inspection solution for total wire bond inspection and detection of hidden connectors

  • Precise, reliable inspection down to wire diameters of approx. 25 µm 
  • Reliable detection of defective wire paths, dies and component position
  • Combined inspection of wire bonds and SMD placement
  • Secure detection of damaged and misplaced components
  • Inspection of conductive adhesive bond
  • Reliable inspection of hidden connectors
  • Individually adaptable inspection scope
  • Simple operation and inspection program generation with EasyPro
  • Possible to read data matrix code from program flow
  • Viscom Quality Uplink: process optimization and first-pass yield increase
  • Best in-line AXI resolution for the highest defect coverage
  • Versatile camera module selection for thick and thin wires
  • Fast image capture process and short analysis times
  • High-power inspection algorithms for all typical wire bond processes
  • In-line capability enables inspection of rapid throughput
  • Simple operation and inspection program generation with EasyPro
  • Traceability, SPC, verification, off-line programming and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptations
  • User interface available in multiple languages
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 20 years bond experience included
  • Over 20 years' AXI experience included
  • Over 30 years AOI experience included
Defect coverage
Missing componentMissing ball/stitchMissed solder joint
Slanted component (tilt)Ball/stitch position out of toleranceInsufficient solder
Face down componentBall/stitch geometry deviationSolder bridging/short circuit,
general solder defects
Tombstoning"Golf club"Nonwetting
Contaminated componentContaminated padMissing conductive adhesive
X/Y component displacementMissing wedgeConductive adhesive residue
Component rotation out of toleranceWedge rotation out of tolerance
Damaged componentWedge geometry deviation
Incorrect componentWedge position out of tolerance
Excess componentsContaminated land, capillary imprint
Component on its sideMissing wire
Twisted leadDefective wire course
Damaged leadNot enough clearance to adjacent wires, short circuit
Lifted lead
Reversed polarity
THT hole fill
Scratched chip surface
Edge chipping
Open area analysisWobble circle errorElectronic color code analysis
OCRVOIDs in the solder jointSolder ball/solder sputter
Coplanarity inspectionBGA head in pillowWicking effect
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, filing, and printing of defect logs
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • Automated grayscale value calibration for constant inspection results
  • User-friendly real image display for better verification (AOI)
  • Selective X-ray inspection for process optimization (AXI OnDemand)
X-ray technology
X-ray tubeSealed or open X-ray tube
High voltage60 - 130 kV 10 - 160 kV
Tube current50 - 300 µA or 5 - 1000 μA
DetectorFlat panel detector (FPD), 14-bit grayscale depth
Resolution8, 10 or 20 μm/pixel, switchable
Z-axis adjustmentMotorized tube z-positioning
X-ray cabinet

Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG) and German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h 

Camera technology*
XM module – orthogonal camera


Field of view40 mm x 40 mm (1.6" x 1.6")
Resolution8 μm
Number of megapixel cameras1
XM module – angled view cameras
Resolution16 μm (standard)
Number of megapixel cameras4/8 (optional)
XM 3D camera technology
Z-rangeUp to 30 mm (1.2")
Z-resolution0.5 μm
User interfaceViscom EasyPro/vVision-ready
Verification stationViscom HARAN
SPCViscom SPC (statistical process control), open interface (optional)
Remote diagnosisViscom SRC (software remote control) (optional)
Off-line programmingViscom PST34 (external programming station) (optional)
Systematic defect analysis and continuous system monitoringViscom PDC (process data control), TCM (technical chain management)
System computer
Operating systemWindows®
ProcessorIntel® Core™ i7
Substrate handling
Substrate sizeUp to 450 mm x 350 mm (17.7" x 13.8") (L x W)
Transport clearance850 - 980 mm ± 20 mm (33.5" - 38.6" ± 0.8")
Double track operationPossible with external PCB modules
Substrate clampingMechanical clamping
Substrate support width3 mm (0.1")
Upper transport clearanceMax. 35 mm (1.4"); FPD with 8 μm resolution: 20 mm (0.8")
Lower transport clearance55 mm (2.2")
Inspection speed
AOI30 - 50 cm²/s
AXIDepending on application
Other system data
Positioning/handling unitSynchronous linear motors
InterfacesSMEMA, SV70, customer specific
Power requirements400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 8 bar working pressure
System dimensionsApprox. 1266 mm x 1626 mm x 2184 mm (49.8" x 64" x 86") (W x H x D)
Line integration dimension+25 mm (1")
WeightApprox. 2500 kg (5512 lbs)


*Other camera technologies on request

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