S3016 ultra - Bottom-Side 3D AOI
Features
3D bottom-side inspection of PCB solder joints
- Highest Performance
Brand new powerful 3D XM sensor concept for bottom-side inspection - Best Inspection Quality
Shadow-free inspection due to 8 angled cameras - Minimum Time and Training Requirements
due to Viscom standard software - System Flexibility
Flexible handling of various test object types - Optimal Inspection Process Design
in terms of enhanced PCB handling options
Viscom-Plus
- Maximum inspection program optimization through integrated verification
- Global libraries, global calibration: Transferability to all systems
- Simple, fast operation and inspection program generation with EasyPro/vVision-ready
- Traceability, SPC, verification, off-line programming, and much more
- Robust inspection strategies using the Viscom standard library for solder joint inspections
- Customer-specific software adaptation
- User interface in nearly every language
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 30 years of AOI experience included
Defect coverage
| SMD | THT | |
| Presence | x | x |
| XY-position | x | x |
| Rotation | x | |
| Component height | x | |
| Polarity | x | |
| No solder | x | x |
| Bad solder | x | x |
| Lifted lead/tombstone | x | |
| Bridge | x | x |
| Pin height | x | |
| Nonwetting pin | x | |
| Nonwetting pad | x | |
| Blow hole | x | |
| Optional: | ||
| Open area analysis | Wobble circle error | Color ring analysis |
| OCR | VOIDs in the soldered connection | Solder ball/solder spray |
Options
- Connection to horizontal interfaces along the production line
- Viscom Quality Uplink – Intelligent networking of Viscom inspection systems along the production line
- Viscom Closed Loop – Intelligent communication of Viscom inspection systems with paste printers and placement machines
- Production line control and product traceability
- Flexible integration of additional production-relevant modules: buffers, label printers, etc.
- Connection to vertical interfaces for communication with MES systems
- Flexible single- or multi-line verification solutions
- Statistical process control Viscom SPC / vSPC
- Offline programming stations for increased efficiency
Specifications
| Inspection scope | 3D AOI | Selective and wave soldering, standard solder joints according to IPC, press fit |
| Camera technology | 3D camera technology | |
| Z-resolution: | 0.5 μm | |
| Z-range: | Up to 30 mm (1.2") | |
| Angled view cameras | ||
| Number of megapixel cameras: | 8 | |
| Orthogonal camera | ||
| Resolution: | 15 μm | |
| Field of view: | 50 mm x 50 mm (2" x 2") | |
| Software | User interface: | Viscom EasyPro/vVision-ready |
| Statistical process control: | Viscom SPC/vSPC, open interface (optional) | |
| Verification station: | Viscom HARAN/vVerify | |
| Remote diagnosis: | Viscom SRC (software remote control) (optional) | |
| Programming station: | Viscom PST34 (optional) | |
| System computer | Operating system: | Windows® |
| Processor: | Intel® Core™ i7 | |
| PCB handling | Transport type: | Single track transport, return transport (optional) |
| PCB dimensions (L x W): | 500 mm x 500 mm, minimum width 70 mm (19.7" x 19.7", min. width 2.8") | |
| Transport height: | 950 - 1000 mm ± 20 mm* (37.4" - 39.4" ± 0.8" ); optional return transport: up to 300 mm (11.8") | |
| Width adjustment: | Automatic | |
| Upper transport clearance: | Up to 80 mm (3.1")* | |
| Lower transport clearance: | Up to 50 mm (2") | |
| Inspection speed | Up to 65 cm²/s | |
| Other system data | Positioning/handling unit: | Synchronous linear motors |
| Interfaces: | SMEMA | |
| Power requirements: | 400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure | |
| System dimensions: | 1094 mm x 1620 mm x 1692 mm (43.1" x 63.8" x 66.6") (W x H x D) | |
| Weight: | 750 kg (1653 lbs) |
*Standard configuration, individual adjustments on request
