S3088 basic – AOI

Features

Full Viscom 2.5D defect detection coverage for placement and solder joint inspection 

  • Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering
  • Revolutionary simplicity in AOI operation with vVision
  • Scalable camera technology and switchable resolution (OnDemandHR)
  • Best resolution at angled views
  • Reliable 01005 and fine-pitch inspection
  • Reading data matrix code, bottom up
  • Throughput burst as add-on
Viscom-Plus
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro/vVision
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Lead-free technology fully supported
  • Tried and tested comprehensive IPC-compliant Viscom inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Insufficient solderExcessive solderMissing solder
Solder bridge/short circuitTombstoneLifted lead
Soldering errorNon-WettingContamination
Missing componentPolarityMisplaced component
X placementY placementRotation
Broken componentWrong componentFlipped component
BillboardingBent leadDamaged lead
Excess componentForm defect
Optional:
Surface inspectionCircumference defectsElectronic color codes
OCRBlow holesSolder balls/splash
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Label printers and bad board markers control
  • Intelligent FIFO buffer
  • Preparation, storage and printing of error logs
  • Automated grayscale value calibration to ensure consistent inspection results
  • Flexible single- and multi-line utilization of the verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
Specifications

Application

Placement and solder joint inspection
(reflow and wave soldering)

Camera technology

Orthogonal camera module 8M (white LEDs):
Field of view: 57.6 x 43.5 mm (2.3" x 1.7")
Resolution: 23.5 µm (standard), 11.75 µm (high) switchable 
with OnDemandHR
Number of megapixel cameras: 4

Angular view camera module 8M (white LEDs):
Resolution: 16.1 µm (standard), 8.05 µm (high) switchable 
with OnDemandHR
Number of megapixel cameras: 4

Software

User interface: Viscom EasyPro/vVision
SPC: Viscom SPC (statistical process control),
open interface (option)
Verification station: Viscom vVerify/HARAN
Remote diagnosis: Viscom SRC (software remote control) 
(option)
Programming station: Viscom PST34 (option)

System computer

Operating system: Windows®
Processor: Intel® CoreTM i7

PCB handling

PCB dimensions: 508 x 508 mm (20" x 20") 
Transport height: 900 to 950 mm ± 20 mm (35.4" x 37.4" 0.8")
Width adjustment: Automatic
Transport concept: Single track transport
PCB clamping: Pneumatic
Upper transport clearance: 35 mm (1.4") 
Lower transport clearance: Up to 60 mm (2.4")

Inspection speed

20 – 40 cm2/s

Other system data

Positioning/handling unit: Synchronous linear motors
Interfaces: SMEMA
Power requirements: 230 V, 50/60 Hz, 1P/N/PE, consumption 0.35 kW, 
compressed air 6 bar (90 psi), 4-6 bar working pressure
System dimensions: 994 mm x 1565 mm x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D)
Weight: 600 kg (1323 lbs)

Zur optimalen Darstellung der Webseite muss Javascript in Ihrem Browser aktiviert sein.

To give you the best possible service, this website uses cookies. By continuing to use our website, you agree to the use of cookies.
OK