S3088 DT – Dual Track 3D AOI
Features
- Technology – High throughput, peak performance camera technology
- Inspection depth – 2D / 2.5D and 3D inspection with up to 8 angled views
- Variant diversity – SPI, AOI, CCI and UFI camera configuration options
- Versatility – Double or single track systems possible
- Networking – Complete connection to cutting-edge Industry 4.0 interfaces
- Footprint – Integrated monitor for reduced system dimensions
Viscom-Plus
- Maximum inspection program optimization through integrated verification
- Global libraries, global calibration: Transferability to all systems
- Simple operation and inspection program generation with EasyPro/vVision-ready
- Traceability, SPC, verification, off-line programming and much more
- Robust inspection strategies using the Viscom standard library for solder joint inspections
- Lead-free technology fully supported
- Tried and tested comprehensive IPC-compliant Viscom inspection library
- Customer-specific software adaptation
- User interface in nearly every language
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 30 years of AOI experience included
Defect coverage
Post Reflow
Insufficient solder | Excessive solder | Missing solder |
Solder bridge, short circuit | Tombstone | Lifted lead |
Soldering error | Non-wetting | Contamination |
Missing component | Polarity | Misplaced component |
X placement | Y placement | Rotation |
Broken component | Wrong component | Flipped component |
Billboarding | Bent lead | Damaged lead |
Excess component | Form defect | |
Optional: | ||
Surface inspection | Circumference defects | Electronic color codes |
OCR | Blow holes | Solder balls/splash |
Options
- Individually configurable high performance optical camera technology (SPI, AOI, CCI, UFI)
- Connection to horizontal interfaces along the production line
- Viscom Quality Uplink – Intelligent networking of Viscom inspection systems along the production line
- Viscom Closed Loop – Intelligent communication of Viscom inspection systems with paste printers and placement machines
- Production line control and product traceability
- Flexible integration of additional production-relevant modules: buffers, label printers, etc.
- Connection to vertical interfaces for communication with MES systems
- Flexible single- or multi-line verification solutions
- Statistical process control Viscom SPC / vSPC
- Offline programming stations for increased efficiency
Specifications
Inspection scope | 3D AOI | Solder joints, placement, solder paste | |
Camera technology | 3D camera technology | ||
Z-resolution | 0.5 μm | ||
Z-range | Up to 30 mm (1.2") | ||
Angled view cameras | |||
Number of megapixel cameras | 8 | ||
Orthogonal camera | |||
Resolution | 10 μm | ||
Field of view | 50 mm x 50 mm (2" x 2") | ||
Software | |||
User interface | Viscom EasyPro/vVision-ready | ||
SPC | Viscom SPC, open interface (optional) | ||
Verification station | Viscom vVerify/HARAN | ||
Remote diagnosis | Viscom SRC (software remote control) (optional) | ||
Programming station | Viscom PST34 (optional) | ||
System computer | |||
Operating system | Windows® | ||
Processor | Intel® Core™ i7 | ||
PCB handling | |||
Transport type | Dual-track transport | ||
PCB dimensions (L x W) | 450 mm x 350 mm (17.7" x 13.8"), minimum width 70 mm (2.8") | ||
Transport height | 900 - 950 mm ± 20 mm (35.4" - 37.4" ± 0.8") | ||
Width adjustment | Automatic | ||
PCB clamping | Pneumatic | ||
Upper transport clearance | 50 mm (2") | ||
Lower transport clearance | 40 mm (1.6")** | ||
Inspection speed | Up to 65 cm²/s | ||
Other system data | |||
Positioning/handling unit | Synchronous linear motors | ||
Interfaces | SMEMA | ||
Power requirements | 400 V (other voltages on request), 3P/N/PE, 8 A, compressed air max. 10 bar (working pressure 4 - 6 bar) | ||
System dimensions | 1094 mm x 1565 mm x 1692 mm (43.1" x 61.6" x 66.6") (W x H x D) | ||
Weight | 1400 kg (3086 lbs) |