S3088 ultra chrome – High-Performance 3D AOI

Features

Extremely fast and precise inspection for high-volume production

  • Highest throughput for manufacturing
  • Reliable quality assurance
  • Highly effective process control tools
  • Simple and intuitive system operation
  • Customer hotline and website, remote maintenance
Viscom-Plus
  • Reliable inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Traceability, SPC, verification, off-line programming and much more
  • Robust inspection strategies using the Viscom standard library for solder joint inspections
  • Inspection in the shortest cycle time
  • Lead-free technology fully supported
  • Successful comprehensive IPC-conformant inspection library
  • Customer-specific software adaptation
  • User interface in nearly every language
  • Viscom Quality Uplink for optimization of the entire process
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Not enough solderToo much solderMissing solder
Solder bridging/short circuitTombstone effectLifted lead
Solder defectsSolderabilityContamination
Missing componentPolarity errorComponent displaced
RotationComponent damagedIncorrect component
Face down componentComponent on its sideTwisted pin
Damaged pinComponent equipped too much Form defects
Optional:
Open area analysisWobble circle errorColor ring
analysis
OCRAir holes in the
soldered connection
Solder ball/solder spray
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Preparation, storage, and printing of error logs
  • Automated grayscale value calibration for constant inspection results
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
Specifications
S3088 ultra chrome
Inspection scope
Solder joints, placement, solder paste
Camera technologyXM
3D sensor technology
- Z-resolution0.5 µm
- Z-RangeUp to 30 mm (1.2")
Angular view cameras
- Number of cameras8
Orthogonal camera 
- Resolution10 µm
- Field of view50 mm x 50 mm (2" x 2)
Inspection speed
Up to 65 cm²/s
Software
User interfaceViscom vVision/EasyPro
SPC Viscom SPC (statistical process control), open interface (optional)
Verification stationViscom vVerify/HARAN
Remote diagnosis

Viscom SRC (software remote control) (optional)

Programming stationViscom PST34 (optional)
System computer
Operating systemWindows®
ProcessorIntel® Core™ i7
PCB handling
PCB dimensions508 mm x 508 mm (20" x 20")
Transport height850 - 950 mm ± 20 mm (33.5" - 37.4" ± 0.8")
Width adjustmentAutomatic
Transport conceptSingle track transport
PCB clampingPneumatic
Upper transport clearance50 mm (2")
Lower transport clearance50 mm (2")
Other system data
Positioning/handling unitSynchronous linear motors
InterfacesSMEMA
Power requirements400 V (other voltages on request), 3P/N/PE, 8 A, 4-6 bar working pressure
System dimensions994 mm x 1565 mm x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D)
WeightMax. 720 kg (1587 lbs)

Zur optimalen Darstellung der Webseite muss Javascript in Ihrem Browser aktiviert sein.