S3088 ultra chrome – High-Performance 3D AOI
Features
Extremely fast and precise inspection for high-volume production
- Highest throughput for manufacturing
- Reliable quality assurance
- Highly effective process control tools
- Simple and intuitive system operation
- Customer hotline and website, remote maintenance
Viscom-Plus
- Reliable inspection program optimization through integrated verification
- Global libraries, global calibration: Transferability to all systems
- Traceability, SPC, verification, off-line programming and much more
- Robust inspection strategies using the Viscom standard library for solder joint inspections
- Inspection in the shortest cycle time
- Lead-free technology fully supported
- Successful comprehensive IPC-conformant inspection library
- Customer-specific software adaptation
- User interface in nearly every language
- Viscom Quality Uplink for optimization of the entire process
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 30 years of AOI experience included
Defect coverage
| Not enough solder | Too much solder | Missing solder |
| Solder bridging/short circuit | Tombstone effect | Lifted lead |
| Solder defects | Solderability | Contamination |
| Missing component | Polarity error | Component displaced |
| Rotation | Component damaged | Incorrect component |
| Face down component | Component on its side | Twisted pin |
| Damaged pin | Component equipped too much | Form defects |
| Optional: | ||
| Open area analysis | Wobble circle error | Color ring analysis |
| OCR | Air holes in the soldered connection | Solder ball/solder spray |
Options
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Control of label printers and bad-board markers
- Intelligent FIFO buffer control
- Preparation, storage, and printing of error logs
- Automated grayscale value calibration for constant inspection results
- Flexible single and multi-line use of verification and repair station
- Management monitoring through Viscom SPC
- User-friendly real image display providing better verification
Specifications
| S3088 ultra chrome | |||
|---|---|---|---|
| Inspection scope | |||
| Solder joints, placement, solder paste | |||
| Camera technology | XM | ||
| 3D sensor technology | |||
| - Z-resolution | 0.5 µm | ||
| - Z-Range | Up to 30 mm (1.2") | ||
| Angular view cameras | |||
| - Number of cameras | 8 | ||
| Orthogonal camera | |||
| - Resolution | 10 µm | ||
| - Field of view | 50 mm x 50 mm (2" x 2) | ||
| Inspection speed | |||
| Up to 65 cm²/s | |||
| Software | |||
| User interface | Viscom vVision/EasyPro | ||
| SPC | Viscom SPC (statistical process control), open interface (optional) | ||
| Verification station | Viscom vVerify/HARAN | ||
| Remote diagnosis | Viscom SRC (software remote control) (optional) | ||
| Programming station | Viscom PST34 (optional) | ||
| System computer | |||
| Operating system | Windows® | ||
| Processor | Intel® Core™ i7 | ||
| PCB handling | |||
| PCB dimensions | 508 mm x 508 mm (20" x 20") | ||
| Transport height | 850 - 950 mm ± 20 mm (33.5" - 37.4" ± 0.8") | ||
| Width adjustment | Automatic | ||
| Transport concept | Single track transport | ||
| PCB clamping | Pneumatic | ||
| Upper transport clearance | 50 mm (2") | ||
| Lower transport clearance | 50 mm (2") | ||
| Other system data | |||
| Positioning/handling unit | Synchronous linear motors | ||
| Interfaces | SMEMA | ||
| Power requirements | 400 V (other voltages on request), 3P/N/PE, 8 A, 4-6 bar working pressure | ||
| System dimensions | 994 mm x 1565 mm x 1349 mm (39.1" x 61.6" x 53.1") (W x H x D) | ||
| Weight | Max. 720 kg (1587 lbs) | ||
