S6056 – High-End 3D AOI

Features

The long-term inspection solution for wave, reflow, pre-reflow and selective soldering

Extremely fast AOI XM 3D camera system
Scalable, modular high performance camera technology with 3D measuring function
Maximum inspection depth: 03015 components
Best resolution at angled views
Height measurement of components
Single- or double-track operation
Also supports larger printed circuit boards
Fast program generation with vVision/EasyPro

Viscom-Plus

Maximum inspection program optimization through integrated verification
Robust short-cycle inspections
Global libraries, global calibration: Transferability to all systems
Simple, fast operation and inspection program generation with EasyPro/vVision-ready
Traceability, SPC, verification, off-line programming, and much more
Lead-free technology fully supported
Tried and tested comprehensive IPC-compliant Viscom inspection library
Customer-specific software adaptation
User interface in nearly every language
Complete statistical process analysis
Independent real-time image processing with Viscom analysis tools
High-performance OCR software
Over 30 years of AOI experience included

Defect coverage

Insufficient solder	Excessive solder	Missing solder
Solder bridge, short circuit	Tombstone	Lifted lead
Soldering error	Non-wetting	Contamination
Missing component	Polarity	Misplaced component
X placement	Y placement	Rotation
Broken component	Wrong component	Flipped component
Billboarding	Bent lead	Damaged lead
Excess component	Form defect
Optional:
Surface inspection	Circumference defects	Electronic color codes
OCR	VOIDs	Solder balls/splash

Options

Freely configurable interfaces to connect various modules
Communication with MES systems
Label printers and bad board markers control
Intelligent FIFO buffer control
Automated grayscale value calibration to ensure consistent inspection results
Preparation, storage and printing of error logs
Flexible single- and multi-line utilization of the classification station
Management monitoring through Viscom SPC
User-friendly real image display providing a better verification
XM ultra high-speed camera technology

Specifications

Application	Solder joint, assembly, solder paste
Transport system	S6056 ST1W: Single track S6056 DS1W: Dual track
Inspection concept	S6056 ST1W: Single inspection S6056 DS1W: Single inspection
Camera technology	XM 3D camera technology: Range: Up to 30 mm (1.2") Z-resolution: 0.5 µm XM module - angled view cameras: Resolution: 16 µm (standard) Number of megapixel cameras: 4/8(optional) XM module - orthogonal camera: Field of view: 40 mm x 40 mm (1.57" x 1.57") Resolution: 16 μm (standard), 8 μm (high) switchable with OnDemandHR Number of megapixel cameras: 1 XMplus/8M camera technology (optional)
Software	User interface: ST1W: Viscom vVision/EasyPro; DS1W: Viscom EasyPro/vVision-ready Verification station: ST1W: Viscom vVerify/HARAN; DS1W: Viscom HARAN SPC: Viscom SPC (statistical process control), open interface (optional) Remote diagnosis: Viscom SRC (optional) Off-line programming: Viscom PST34 (external programming station) (optional)
System computer	Operating system: Windows® Processor: Intel® Core™ i7
PCB handling	PCB dimensions (L x W): 457 mm x 356 mm (17.9" x 14.0") (Specification of the DS1W version, other sizes optional) PCB carrier: 1 - 5 mm (0.04" - 0.2") (lower thicknesses optional) Transport height: 850 - 960 mm ± 20 mm (33.5" to 37.8" ± 0.8") Width adjustment: Automatic PCB clamping: Pneumatic PCB contact area: 3 mm (0.1") Upper transport clearance: 50 mm (1.9") Lower transport clearance: 40 mm (1.6") (other hights upon request)
Inspection speed	Up to 65 cm²/s, minimized handling time
Other system data	Positioning/handling unit: Synchronous linear motors Interfaces: SMEMA, SV70, customer specific Power requirements: 400 V (other voltages on request), 3P/N/PE, 8 A, 4-6 bar working pressure System dimensions: 1528 mm x 1650 mm x 1692 mm (60.2" x 65.0" x 66.7") (W x H x D) Weight (max.): 1700 kg (3747 lbs)