S6056 – High-End 3D AOI
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering
- Extremely fast AOI XM 3D camera system
- Scalable, modular high performance camera technology with 3D measuring function
- Maximum inspection depth: 03015 components
- Best resolution at angled views
- Height measurement of components
- Single- or double-track operation
- Also supports larger printed circuit boards
- Fast program generation with vVision/EasyPro
- Maximum inspection program optimization through integrated verification
- Robust short-cycle inspections
- Global libraries, global calibration: Transferability to all systems
- Simple, fast operation and inspection program generation with EasyPro/vVision-ready
- Traceability, SPC, verification, off-line programming, and much more
- Lead-free technology fully supported
- Tried and tested comprehensive IPC-compliant Viscom inspection library
- Customer-specific software adaptation
- User interface in nearly every language
- Complete statistical process analysis
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
- Over 30 years of AOI experience included
Insufficient solder | Excessive solder | Missing solder |
Solder bridge, short circuit | Tombstone | Lifted lead |
Soldering error | Non-wetting | Contamination |
Missing component | Polarity | Misplaced component |
X placement | Y placement | Rotation |
Broken component | Wrong component | Flipped component |
Billboarding | Bent lead | Damaged lead |
Excess component | Form defect | |
Optional: | ||
Surface inspection | Circumference defects | Electronic color codes |
OCR | Blow holes | Solder balls/splash |
- Freely configurable interfaces to connect various modules
- Communication with MES systems
- Label printers and bad board markers control
- Intelligent FIFO buffer control
- Automated grayscale value calibration to ensure consistent inspection results
- Preparation, storage and printing of error logs
- Flexible single- and multi-line utilization of the classification station
- Management monitoring through Viscom SPC
- User-friendly real image display providing a better verification
- XM ultra high-speed camera technology
Application | Solder joint, assembly, solder paste |
Transport system | S6056 ST1W: Single track |
Inspection concept | S6056 ST1W: Single inspection |
Camera technology | XM 3D camera technology: Resolution: 16 µm (standard) Number of megapixel cameras: 4/8(optional) XM module - orthogonal camera: XMplus/8M camera technology (optional) |
Software | User interface: |
System computer | Operating system: Windows® |
PCB handling | PCB dimensions (L x W): 457 mm x 356 mm (17.9" x 14.0") |
Inspection speed | Up to 65 cm²/s, minimized handling time |
Other system data | Positioning/handling unit: Synchronous linear motors |