X7056-II – 3D AXI/3D AOI


3D X-ray inspection – Extremely fast and flexible

  • Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds
  • Ultra thorough inspection of single or double-sided electronic assemblies
  • System can be used as a 3D AXI system or 3D AXI/3D AOI combination
  • Three different flat panel detector sizes for scalable throughput
  • Versatile and adaptable inspection depth
  • Additional vertical slices for optimum analyses and dependable verification
  • Viscom Quality Uplink: Effective networking and process optimization
  • Comprehensive IPC-compliant AXI inspection library
  • High-quality 3D AXI volume calculation with planar CT
  • Highest in-line AXI resolution for the best defect coverage and detection
  • Maximum inspection program optimization through integrated verification
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with vVision/EasyPro
  • Traceability, SPC, verification, off-line programming and much more
  • Full support for lead-free technology
  • Customer-specific and customizable software adaptation
  • User interface available in multiple languages
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 20 years of AXI experience included
Defect coverage
Insufficient solderExcess solderMissing solder
Solder bridging/short circuitTombstone effectLifted lead
Solder defectSolderabilityContamination
Missing componentPolarity errorDisplaced component
RotationComponent damagedIncorrect component
Face down componentComponent on its sideExcess components
Form defectsTwisted pinDamaged pin
THT filling degreeVoids in the solder jointBGA head in pillow
Open area analysisWobble circle errorWicking effect
Color ring analysisOCRSolder ball/solder spray
VOIDs in the solder joint
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad board markers
  • Intelligent FIFO buffer control
  • Preparation, filing, and printing of defect logs
  • Flexible single and multi-line use of verification and repair stations
  • Management monitoring through Viscom SPC
  • Automated grayscale value calibration for constant inspection results
  • User-friendly real image display for better verification (AOI)
  • Selective X-ray inspection for process optimization (AXI OnDemand)
Camera technology
X-ray tubeSealed X-ray tube
High voltage60 - 130 kV
X-ray current50 - 300 µA
DetectorFlat panel detector (FPD), 14-bit grayscale value depth
Resolution6 - 30 μm/pixel (depending on configuration)
X-ray cabinet

Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG) and German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h 

Detector configuration1 FPD on xy-table, 5 fixed FPDs (additional on request)
XM camera technologyImage field size40 mm x 40 mm (1.6" x 1.6")
ResolutionUp to 8 µm
Number of megapixel camerasUp to 9
3D height measurement areaUp to 30 mm (1.2")
Z-resolution0.5 μm
Number of megapixel cameras4 (8, optional)
XMplus camera technology (optional)
User interfaceViscom vVision/EasyPro
SPCViscom vSPC/SPC (statistical process control), open interface (optional)
Verification stationViscom vVerify/HARAN
Remote diagnosisViscom SRC (optional)
Programming stationViscom PST34 (optional)
Operating systemWindows®
ProcessorIntel® Core™ i7
PCB handling
PCB dimensions450 mm x 350 mm (17.7" x 13.8") (L x W)
Transport height850 - 980 mm ± 20 mm (33.5" - 38.6" ± 0.8")
Width adjustmentAutomatic during setup
PCB clampingPneumatic
PCB support area3 mm (0.1")
Upper transport clearanceUp to 50 mm (2")
Lower transport clearance50 mm (2")
Inspection speed
AOIUp to 65 cm²/s
AXIDepending on application,
handling time ≥ 4 s (with xFastFlow)
Other system data
Positioning/handling unitSynchronous linear motors
InterfacesSMEMA, SV70, customer specific
Power requirements400 V (other voltages on request), 3P/N/PE, 8 A, 4-6 bar working pressure 
System dimensions1493 mm x 1631 mm x 2251 mm (58.8" x 60.3" x 88.6") (W x H x D);
width incl. xFastFlow: 1933 mm (76.1")
Line integration dimension+25 mm (1")
Weight2245 kg (4949 lbs)


Subject to technical changes. Windows® and Intel® Core™ i7 are registered trademarks.

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