X7058 – 3D AXI


High-end system for 3D X-ray inspection

  • 100 % top- and bottom-side 3D X-ray inspection
  • Automatic side separation of assemblies populated on both sides
  • Viscom MFD X-ray sensor technology for excellent 3D image quality in the shortest time
  • Best 3D AXI resolution for the highest defect coverage
  • Ultra-short handling times through innovative multi-chamber concept
  • Configurable number of section images
  • Viscom Quality Uplink: Process optimization and increased first pass yield
  • Comprehensive IPC-compliant inspection library
  • Maximum inspection program optimization through integrated verification 
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with vVision
  • Traceability, SPC, verification, off-line programming and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptations possible
  • Innovative multi-chamber concept 
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • Over 20 years' AXI experience included
Defect coverage
Insufficient solderExcessive solderMissing solder
Solder bridging/short circuitSolder defectWettability
TombstoningLifted leadContamination
Missing componentPolarity defectDisplaced component
RotationDamaged componentIncorrect component
Face down componentComponent on its sideExcess component
Bent leadDamaged leadTHT filling degree
BGA head-in-pillowWicking-up effect
Open area inspectionSolder balls/splashBlowholes in solder joints
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad board markers
  • Intelligent FIFO buffer control
  • Preparation, storage and printing of error logs
  • Versatile single- and multi-line use of verification station
  • Management monitoring through Viscom SPC
  • Automated grayscale value calibration for constant inspection results
  • User-friendly real image display providing better verification
Inspection concept


X-ray technologyX-ray tube: Closed X-ray tube
High voltage: 40 - 130 kV
Tube current: 10 - 390 μA
Camera: Line scan
Resolution: 8 - 25 µm
Z-axis adjustment: Powered z-axis tube adjustment
X-ray cabinet: In compliance with the German X-ray regulations (RöV) regarding fully protected devices. Leakage radiation < 1μSv/h

User interface: Viscom vVision 
Verification station: Viscom vVerify 
SPC: Viscom SPC (statistical process control), open interface (optional)
Remote diagnosis: Viscom SRC (software remote control) (optional)
Off-line programming: Viscom PST34 (external Programming Station) (optional)

System computer

Operating system: Windows®
Processor: Intel® Core™ i7

PCB handling

PCB dimensions: 558 mm x 508 mm (22“ x 20“) (L x W)
Transport height: 870 - 960 mm ± 20 mm (34.3“ - 37.8“ ± 0.8“)
Width adjustment: Automatic
PCB edge clearance: 3 mm (0.12")
Upper transport clearance: 15 - 50 mm (0.59“ -  1.97“)
Lower transport clearance: 60 mm (2.36“)

Other system data

Interfaces: SMEMA, SV70, customer specific
Power requirements: 400 V (other voltages on request), 3P/N/PE, 11 A
System dimensions: 1992 mm x 1902 mm x 1942 mm ( 78.4“ x 74.9“ x 76.5“) (W x H x D) (including signal tower)
Line integration dimensions: + 25 mm (1“)
Weight: 2400 kg (5291 lbs)

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