S6053BO-V – Inline-AOI


Reliable inspection of wire bonds, components and conductive adhesive in one step

  • Inspection of minimal wire thicknesses up to 15 µm
  • Reliable differentiation of wire courses
  • Recognition of defective bonds
  • Reliable SMD component inspection
  • Inspection of conductive adhesive bond
  • Simple operation and inspection program generation with EasyPro
  • Flexible conveyor concept: Single track or double track
  • The data matrix code can be read from the program flow
  • Robust short-cycle inspections
  • The in-line capability enables inspection of rapid throughput
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro
  • Uniform camera technology ensures full inspection program compatibility
  • Traceability, SPC, verification, off-line programming, and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptation
  • Constant-specific conveyor concepts are possible
  • Minimum footprint in line
  • Over 20 years of bond AOI experience included
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Missing ball/stitchPosition ball/stitch exceeds tolerance

Shape and geometry ball/
stitch exceed tolerance

"Golf clubs"Pad contaminationMissing wedge

Wedge position exceeds

Foreign material, pad contaminationMissing wire
Incorrect wire loopCurling, shortageMissing component

angle exceeds tolerance

Tilted componentWrong component type
Reversed polarity

Scratches/foreign material on surface

Flipped component

Missing/excessive epoxy underfill

Insufficient solder
Excessive solderMissing solderSolder bridge/short
TombstoneLifted leadSoldering error
Non-WettingContaminationMisplaced component
X placementY placementRotation of solder paste
Broken componentWrong componentExcess component
BillboardingForm defectBent lead
Damaged lead
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Intelligent FIFO buffer control
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the verification and repair station
  • Automated grayscale value calibration to ensure consistent inspection results
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
ApplicationBall-bond, wedge-bond, wire, die/SMD
Camera technology


XM HR bond module:
Number of modules per machine: Typical 1
Number of mega pixel cameras: 1
Pixel size: Typical 4,5 μm/pixel

User interface: Viscom EasyPro
SPC: Viscom SPC (statistical process control), open interface (option)
Verification station: Viscom HARAN
Remote diagnosis: Viscom SRC (option)
Programming station: Viscom PST34 (option)

System computer

Operation system: Windows®
Processor: Intel® Core™ i7

Substrate handling

Substrate dimensions:
Single-track: 280 x 300 mm (6.0" x 5.0") (L x W)
Dual-track: 280 x 130 mm (6.0" x 4.0") (L x W)                                                             Dual shuttle: 210 mm x 130 mm
Further dimensions on request

Transport height: 860 - 1180 mm ± 20 mm (33.86" - 46.46" ± 0.79")
Width adjustment: Option
Handling unit: Synchronous linear motors
Dual-track operation: With internal shuttle (external shuttle optional)
Substrate fixing: Vacuum or mechanical clamping
Upper transport clearance: 15/35 mm (depending on camera technology
− other camera options available on request)

Inspection speed> 1000 wire bond connections/min.
depending on inspection object characteristics
Other system data

Interfaces: SMEMA, SV70, customer-specific
Power requirements: 400 V (other voltages on request), 3 P/N/PE, 8 A, 4-6 bar working pressure
System dimensions: 813 x 1615 mm x 1055 mm
(32.0" x 63.6" x 41.5") (W x D x H), Dual-shuttle: W: max. 1000 mm (39.4")
Weight: 800 kg (1764 lbs)




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