S6056BO – Inline AOI

Features

High-performance automatic in-line wire bond inspection for high throughput

  • Precise, reliable inspection down to wire diameters of 17 µm 
  • Reliable detection of defective wire paths, dies and component position
  • Combined inspection of wire bonds and SMD placement
  • Secure detection of damaged and misplaced components
  • Inspection of conductive adhesive bond
  • Reliable inspection of larger inspection objects
  • Individually adaptable inspection scope
  • Simple operation and inspection program generation with EasyPro
  • Possible to read data matrix code from program flow
  • Ideal for double track operation
Viscom-Plus
  • Fast image capture process and short analysis times
  • High-power inspection algorithms for all typical wire bond processes
  • In-line capability enables inspection of rapid throughput
  • Compatible with all Viscom bond camera modules
  • Simple operation and inspection program generation with EasyPro/vVision (S6056BO DS2W: EasyPro/vVision-ready)
  • Traceability, SPC, verification, off-line programming and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptations
  • Customer-specific transport concepts possible
  • User interface available in multiple languages
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 20 years bond experience included
  • Over 30 years AOI experience included
Defect coverage
Missing componentMissing ball/stitchMissed solder joint
Slanted component (tilt)Ball/stitch position out of toleranceInsufficient solder
Face down componentBall/stitch geometry deviationSolder bridging/short circuit,
general solder defects
Tombstoning"Golf club"Nonwetting
Contaminated componentContaminated padMissing conductive adhesive
X/Y component displacementMissing wedgeConductive adhesive residue
Component rotation out of toleranceWedge rotation out of tolerance
Damaged componentWedge geometry deviation
Incorrect componentWedge position out of tolerance
Excess componentsContaminated land, capillary imprint
Component on its sideMissing wire
Twisted leadDefective wire course
Damaged leadNot enough clearance to adjacent wires, short circuit
Lifted lead
Reversed polarity
THT hole fill
Void
Scratched chip surface
Edge chipping
Optional:
Open area analysisWobble circle errorElectronic color code analysis
OCRBlow holes in the solder jointSolder ball/solder sputter
Coplanarity inspection
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Control of label printers and bad-board markers
  • Intelligent FIFO buffer control
  • Automated grayscale value calibration for constant inspection results
  • Preparation, filing, and printing of defect logs
  • Flexible single and multi-line use of verification and repair station
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing better verification
  • XM ultra-high-speed camera technology
Specifications
ApplicationBall-bond, wedge-bond, wire, die/SMD. ribbon
Camera technology

Ultra-high resolution VHR module:
Number of modules per machine: Typical 1 
Number of mega pixel cameras: 1
Pixel size: Typical 5 μm/pixel or 2.5 μm/pixel
Further cameras available on request

Standard module 8M-1SRWBond:
Number of modules per machine: Typical 1
Number of mega pixel cameras: 1
Pixel size: Typical 10 μm/pixel
Further cameras available on request

Software

User interface: Viscom EasyPro
SPC: Viscom SPC (statistical process control), open interface (option)
Verification station: Viscom HARAN
Remote diagnosis: Viscom SRC (option)
Programming station: Viscom PST34 (option)

System computer

Operation system: Windows®
Processor: Intel® Core™ i7

Substrate handling

Substrate dimensions:
Single-track: 152 x 127 mm (6.0" x 5.0") (L x W)
Dual-track: 290 x 200 mm (11.4" x 7.9") (L x W)
Further dimensions on request

Transport height: 860 - 1180 mm ± 20 mm (33.86" - 46.46" ± 0.79")
Substrate fixing: Vacuum or mechanical clamping
Upper transport clearance: 15/35 mm (depending on camera technology
− other camera options available on request)

Inspection speed
up to 65 cm²/s, minimized handling time
Other system data

Interfaces: SMEMA, SV70, customer-specific
Power requirements: 400 V (other voltages on request), 3 P/N/PE, 8 A
System dimensions: 1100 x 1650 x 1692 mm
(43.3" x 65" x 66.6") (W x D x H)
Weight: 1700 kg (3748 lbs)

 

 

 

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