S6053BO-V – Inline-AOI

Features

Reliable inspection of wire bonds, components and conductive adhesive in one step

  • Inspection of minimal wire thicknesses up to 15 µm
  • Reliable differentiation of wire courses
  • Recognition of defective bonds
  • Reliable SMD component inspection
  • Inspection of conductive adhesive bond
  • Simple operation and inspection program generation with EasyPro
  • Flexible conveyor concept: Single track or double track
  • The data matrix code can be read from the program flow
Viscom-Plus
  • Robust short-cycle inspections
  • The in-line capability enables inspection of rapid throughput
  • Global libraries, global calibration: Transferability to all systems
  • Simple operation and inspection program generation with EasyPro
  • Uniform camera technology ensures full inspection program compatibility
  • Traceability, SPC, verification, off-line programming, and much more
  • Lead-free technology fully supported
  • Customer-specific software adaptation
  • Constant-specific conveyor concepts are possible
  • Minimum footprint in line
  • Over 20 years of bond AOI experience included
  • User interface in nearly every language
  • Complete statistical process analysis
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
  • Over 30 years of AOI experience included
Defect coverage
Missing ball/stitchPosition ball/stitch exceeds tolerance

Shape and geometry ball/
stitch exceed tolerance

"Golf clubs"Pad contaminationMissing wedge

Wedge position exceeds
tolerance

Foreign material, pad contaminationMissing wire
Incorrect wire loopCurling, shortageMissing component

Positon/rotation
angle exceeds tolerance

Tilted componentWrong component type
Reversed polarity

Scratches/foreign material on surface

Flipped component
Chipping

Missing/excessive epoxy underfill

Insufficient solder
Excessive solderMissing solderSolder bridge/short
TombstoneLifted leadSoldering error
Non-WettingContaminationMisplaced component
X placementY placementRotation of solder paste
Broken componentWrong componentExcess component
BillboardingForm defectBent lead
Damaged lead
Options
  • Freely configurable interfaces to connect various modules
  • Communication with MES systems
  • Intelligent FIFO buffer control
  • Preparation, storage and printing of error logs
  • Flexible single- and multi-line utilization of the verification and repair station
  • Automated grayscale value calibration to ensure consistent inspection results
  • Management monitoring through Viscom SPC
  • User-friendly real image display providing a better verification
Specifications
Transport systemSingle trackDouble trackDual shuttle
Inspection concept
Single inspection
Inspection scopeBondBall bond, wedge bond, wire, die/SMD, ribbon
Camera technologyStandard configuration XM Bond HR*
Number of modules per machine: 1
Number of cameras:1
Pixel size:4,5 μm/pixel
SoftwareUser interface:Viscom EasyPro
SPC:Viscom SPC (statistical process control), open interface (optional)
Verification station:Viscom HARAN
Remote Diagnosis:Viscom SRC (software remote control) (optional)
Programming station:Viscom PST34 (optional)
System computerOperating system:Windows®
Processor:Intel® Core™ i7
Substrate handlingMax. substrate size:280 mm x 300 mm (L x W)
(11" x 11.8") (L x W)
280 mm x 130 mm (L x W)
(11" x 5.1") (L x W)
210 mm x 130 mm (L x W)
(8.3" x 5.1") (L x W)
Transport clearance:860 - 1180 mm ± 20 mm (33.9" - 46.5" ± 0.8")
Substrate clamping:Vacuum or mechanical clamping
Upper transport clearance:Up to 35 mm (1.4")
Inspection speed> 1000 wire bond connections/min., depending on inspection object characteristics
Other system dataPositioning/handling unit:Synchronous linear motors
Interfaces: SMEMA, SV70, customer-specific
Power requirements:400 V (other voltages on request), 3P/N/PE; 8 A, 4-6 bar working pressure 
System dimensions :813 - 1000 mm x 1615 mm x 1055 mm (32" - 39.4" x 63.6" x 41.5") (W x H x D)
Weight:800 kg (1764 lbs)

 

*Other camera technologies and substrate sizes on request

 

 

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