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S3088 ultra chrome: excellent 3D solder paste inspection system with advanced camera technology

Viscom’s compact SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately recorded. The 3D inline system demonstrates our decades of experience in reliable, high throughput solder paste inspection systems. The latest sensor technology with an orthogonal camera and four lateral views results in the highest inspection quality. Realistic color images ensure quick and clear verification. The FastFlow handling guarantees an extremely high throughput thanks to synchronous in- and outfeed of the assemblies. The system can achieve handling times of up to 2.5 seconds with minimal mechanical impact loads. Intelligent networking in the SMT line enhances your process stability and efficiency.

 

Inspection scope

  • 100% defect identification for ultimate reliability
  • Cutting-edge, calibration-free 3D camera technology
  • Improved inspection speed
  • Module change in up to 2.5 seconds
  • End-to-end process analysis with Viscom Quality Uplink
  • Closed loop enhances quality and efficiency
  • Integrated verification
  • Global libraries, global calibration: transferability to all systems
  • Traceability, offline programming, statistical process control
  • Independent real-time image processing with Viscom analysis tools
  • Simple process analysis with the Viscom Uplink Analyzer
  • High-performance OCR software

 

Inspects solder paste deposits (pad sizes from 01005 components) and dispenser paste for surface, height and shape

Defects/defect features:     too much/too little solder, solder skip, print displacement (X/Y offset), paste                                                  smearing

optional:                            coplanarity, open area analysis, OCR, DCM

DIMENSIONS  
System housing: 994 mm x 1565 mm x 1349 mm (W x H x D)
   
SENSORS  
3D camera technology: XM SPI camera module
Procedure: structured light projection with four angled views
Z-resolution: 0,1 μm
Resolution of orthogonal camera: 10 μm
Field of view size: 58,2 mm x 58,2 mm
   
INSPECTION  
Speed: 90 cm²/s
   
HANDLING  
PCB size: 508 mm x 508 mm
   
SOFTWARE  
User interface: Viscom vVision/EasyPro

ADVANTAGES AT A GLANCE

  • Latest 3D camera technology
  • Ultra-fast inspection – also with dual-track operation
  • Shadow-free, seamless solder joint inspection
  • Closed loop function with solder paste printer
  • Effective process control and optimization in real time

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