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Christian Palm
Viscom AG Project Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
christian.palm@viscom.de +49 511 94996-892
Bastian Tschirch
Viscom AG Project Manager - Customer Care Team S2
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
bastian.tschirch@viscom.de +49 511 94996-762
Mirko Weißgerber
Deputy Vice President - Customer Care Team S2
Carl-Buderus-Str. 9 - 15 30455 Hanover Germany
mirko.weissgerber@viscom.de +49 511 94996-884
Tom Van Tongelen
Smd-Tec bvba Viscom Distributor
Industriezone D124 Ter Heidelaan 54C 3200 Aarschot Belgium
info@smd-tec.be +32 16436742 +32 16437220
Patrick Schwärzel
Viscom AG Deputy Vice President Customer Care Team S1
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
patrick.schwaerzel@viscom.de +49 511 94996-748
Sascha Wilkening
Viscom AG Service Manager - Customer Care Team S1
Carl-Buderus-Straße 9 - 15 30455 Hanover Germany
Sascha.Wilkening@viscom.de +49 511 94996-647
Semicon Taiwan 2024
09/04/2024 - 09/06/2024
Taipei Nangang Exhibition Center
Taipei
Taiwan
Semicon Taiwan is an international trade fair for semiconductor technology and the most important trade event for the micro- and nanoelectronics industry in Taiwan. Topics include technologies for the development and manufacture of semiconductors, solar cells and other micro- and nanoelectronic products.
Nepcon China 2024
04/24/2024 - 04/26/2024
Shanghai World Expo Exhibition & Convention Center
Booth: 1J20
Shanghai
China
The exhibition will bring together 600 exhibiting brands and companies to showcase the world's first new products of PCBA, including surface mount (SMT), smart factory and automation technology, dispensing and spraying, test and measurement, electronic manufacturing services (EMS) and other exhibition areas.
High Volume: iS6059 PCB Inspection
Efficient iS6059 PCB Inspection The iS6059 PCB Inspection combines precise fault detection with high inspection speed for mass production. Other benefits: Fast programming, intuitive operation, and Industry 4.0 integration. XMs-II / XM8-II 1 orth and 8 angled cameras Resolution: 10 µm/pixel / 8 µm/pixel FOV: 50 x 50 mm / 40 x 40 mm For: assembly inspection, component control, solder joint inspection
Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection