Page
iS6059 SPI – excellent 3D solder and sinter paste inspection Viscom’s powerful SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as vol
Page
Identify wire defects with absolute reliability Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. A
Page
X8011-III – 2D and 3D X-ray inspection fast, smart, economical and easy By loading the video, you accept the YouTube privacy policy. Learn more Load video Always unblock YouTube The Viscom X-ray syste
Page
S6053BO-V: Reliable 2D and 3D Wire Bond Inspection The smaller the inspection objects, the more important precision and repeat accuracy are in the inspection. Manufacturers of high-end electronics who
Page
Quick, Precise Inspection – X7056-II BO for Bonding Wires Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The X7056-II BO
Page
Microfocus X-ray Tubes for Ultra-Sharp Images Our microfocus X-ray tubes can be found in high-quality Viscom inspection systems that are used worldwide for quality control in electronics manufacturing
Page
Keeping You up to Date with the Latest Developments in Inspection Technology Viscom inspection systems are also a good long-term investment. Our upgrades provide you with the benefits of new technolog
Page
Providing the Right Service, When and Where You Need It Viscom service, like Viscom inspection systems, is designed to make your inspection processes faster, more accurate and more reliable – no matte
Page
Viscom Training Center: Where Our Partners Come for Maximum Performance From programming and operation to verification, process control, diagnostics and calibration: the Viscom Training Center is wher