Unrivaled image quality down to an astonishing 1μm resolution for the inspection of intricate semiconductor devices to complex leadframe applications capturing every detail with breathtaking clarity.

• Inspect objects up to 15 kg
• Resolution down to 1 μm

For: Solder bump inspection, microcracks, void analyses, leadframe inspection, solder layer quality, cold solder joints, solder joint morphology, HiP for solder bumps, wirebond defects, advanced packaging applications

The iS6052 CCI – Precisely detects missing or defective conformal coatings using Special premium-grade, high-power LEDs that also can be used for coatings containing silicone or particularly thinly applied coatings that are less reflective.

Camera Technology: XM Basic CCI & XM Basic CCI Extended
1 orth and 4 angled cameras (depends on configuration)
Resolution: 12 μm
FOV: 50 x 50 mm

For: Conformal Coating Inspection

The iS6052 THT is developed for the precise placement of components on THT (Through-Hole Technology) boards. Using advanced AOI (Automated Optical Inspection) technology, the iS6052 THT system performs inspections from above.

Camera Technology: XM Basic THT
1 orth and 4 angled cameras
Resolution: 12 μm
FOV: 50 x 50 mm

For: assembly inspection, component control, solder joint inspection

The iS6052 AOI is optimized for mass-production and offers a compelling option for manufacturers looking to enhance their 3D PCB inspection processes without breaking the bank.

Camera Technology: XM Basic
1 orth and 4 angled cameras
Resolution: 12 μm
FOV: 50 x 50 mm

Intended for: assembly inspection, component control, solder joint inspection

The iS6052 SPI - Reliable 3D solder paste inspection with unique and proven XM camera technology for shadow free results and effortless verification.

Camera technology: XM SPI
1 orth and 4 angled cameras
Resolution 12 μm
FOV: 58 x 58 mm

For: Solder Paste Inspection

Innovative iS6059 Double-Sided Inspection
Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology.

1 orth. and 8 angled cameras from above
1 orth. and 8 angled cameras from below
Resolution: 13 µm/pixel
FOV: 50 x 50 mm

For: assembly inspection, component control, solder joint inspection

High-throughput 3D solder paste inspection with the most advanced sensors for shadow-free results and super-easy verification.

1 orth. and 4 angled cameras
Resolution: 12 µm/pixel
FOV: 58 x 58 mm
Single-track transport system

For: Solder paste inspection

Advanced iS6059 THT Inspection
Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers.

1 orth and 8 angled cameras
Resolution: 13 µm/pixel
FOV: 50 x 50 mm

For: assembly inspection, component control, solder joint inspection

Efficient iS6059 PCB Inspection
The iS6059 PCB Inspection combines precise fault detection with high inspection speed for mass production.
Other benefits: Fast programming, intuitive operation, and Industry 4.0 integration.

Camera technology: XMs-II / XM8-II
1 orth and 8 angled cameras
Resolution: 10 µm/pixel / 8 µm/pixel
FOV: 50 x 50 mm / 40 x 40 mm

For: assembly inspection, component control, solder joint inspection

Enhanced 3D image quality and repeatability, thanks to 3D hardware acceleration. Character recognition of even taller components, made possible by greater orthogonal depth of field. Inspection devices are intelligently networked to improve machine communication. 

With its new XMplus-II camera technology and easy programmability, this innovative system from Viscom sets new standards in premium 3D AOI inspection. 

XMplus-II camera module 
1 orthogonal and 8 inclined cameras 
Resolution: 20.4 µm/pixel +/-1% (binning); 10.2 µm/pixel +/-1% 
FOV: approx. 50 mm x 50 mm

Intended for: assembly control, component inspection, solder joint inspection 

The new 3D X-ray generation for highly accurate and fast inline inspection of printed circuit boards with a unique, dynamic image acquisition approach.

• Inspection objects up to 15 kg
• Rapid inspectioning speed and extremely fast handling

For: Solder joint inspection, THT assembly and selective solder joints, void inspection surface soldering, LEDs, server boards, 3D computer tomography

The new 3D X-ray generation for highly accurate and fast inspection of large assemblies, such as high-voltage electronics and power electronics.

• Inspection objects up to 40 kg
• Handling of workpiece carriers and soldering frames

For: Solder joint inspection, THT assemly and selective solder joints, void inspection glue joints, high voltage electronics, 3D computer tomography

Fully automated 3D X-ray inspection with integrated computed tomography for quality assurance of power semiconductors.

For: THT assembly and selective solder joints, hidden blow holes (voids) in surface soldering

A new generation of X-rays for very fast 2D inspection of mobile devices such as mobile phones, tablets, notebooks, or wearables to ensure reliable quality assurance and product end control.

For: Final inspection of complete products, mobile devices

Combined 3D AOI and 3D AXI in one system — space-saving, powerful, and with extremely high throughput. The fast-flow option allows handling times of approximately 2.5 seconds. Ensures seamless quality control in the SMT line. For PCBs up to 450 mm x 350 mm (L x W).

For: Component inspection, solder joint inspection, THT ssembly and selective solder joints, void inspection glue joints

The flexible manual X-ray system is used for materials examination and solder joint inspection of high-end electronics. The X8011-III offers outstanding image quality, user-friendly operation, and fast programming.

For: Solder joint inspection, THT selective solder inspection, void inspection surface soldering, 3D computed tomography, final inspection of equipment

The manual system is ideal for automatic X-ray inspection of heavier and larger inspection objects up to 722 mm in diameter. Due to the simple loading and unloading operations, larger individual objects, as well as product carriers, can be inspected.

For: Solder joint inspection, THT assembly and selective solder joints, void inspection glue joints, 3D computed tomography, final inspection complete products

Automatic optical wire bond inspection with configurable transport. Best inline technology for maximum performance - compatible with all Viscom bond camera modules.

Particularly precise with height information thanks to 3D technology for thick-wire and thin-wire control.

For: Wire bond inspection, semiconductor, package substrates

Combined bond Aoi and bond Axi in one system.

• Additional inspection options with automatic X-ray
• Versatile camera module selection for thick and thin wires
• Maintenance-free sealed microfocus X-ray tube

For: Wire bond inspection, semiconductor, package substrates

Viscom develops and manufactures micro-focus X-ray tubes at the highest level. The product portfolio includes direct beam and transmission tubes with voltages up to 250 kV.

In addition to product adaptations such as special mounting holes, Viscom also develops custom-made products.

For: Micro-focus X-ray tubes

The combination of CT and a micro-focus X-ray tube non-destructive inspection on castings, electronic components, ceramic parts, and much more. The three-dimensional inspection method provides insight into the internal structure of the inspection object.

Available for manual Viscom X-ray systems and 3D inline X-rays as an option.

For: 3D computed tomography, final inspection of complete products

Wherever Viscom's standardized inline systems cannot be used directly, the “End of line inspection” product approach offers a flexible way to adapt to the specific task. Reach out to us!

• The application of Viscom standards for camera technology and software
• Wide range of resolutions and field of view sizes
• 2D and 3D inspection
• Integrates into customer-specific environments

For: Final inspection of complete products, customer-specific solutions, direct copper bondes (DCB)

The Viscom subsidiary Exacom GmbH develops tailor-made X-ray solutions for high-precision battery inspection. The focus is on rapid image acquisition and handling of different cell types such as coin cells, cylindrical cells and pouch cells.

For: Battery cell inspection, energy storage products