Solder Paste Inspection | 3D SPI

Conformal Coating Inspection


High-precision 3D AOI in dual-track operation

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S3088 DT: the number one choice for high-throughput SMT manufacturing with excellent ROI

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The S3088 DT is a 3D AOI system that uniquely combines efficiency, speed and technical performance to meet the requirements of mass production today. The S3088 DT can also be fully connected to cutting-edge Industry 4.0 interfaces. The system guarantees reliable inspection of complex 03015 components – coupled with an impressive throughput rate. The S3088 DT adapts easily to the varying track widths of the relevant production jobs and can also be used in single-track operation to inspect larger printed circuit boards. The machine features an integrated monitor, giving it an especially compact design and small footprint. The S3088 DT camera system provides outstanding flexibility: in addition to a configuration for handling the most sophisticated 3D AOI tasks, the system also provides configurations for solder paste inspection (3D SPI), conformal coating inspection (CCI) and underfill inspection (UFI).

Inspection scope

  • Space-saving system design with integrated monitor
  • Ideal system configuration with respect to costs/benefits
  • Impressive throughput rate in dual-track operation
  • Can be flexibly adjusted to varying trackwidths; also suitable for single-track applications
  • Rapid inspection speeds of up to 65 cm²/s
  • One orthogonal camera and eight angled view cameras provide virtually shadow-free 3D inspections
  • Verified zero defect slippage thanks to integrated verification
  • Global libraries, global calibration: transferability to all systems
  • Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
  • Traceability, offline programming, statistical process control
  • Communication with MES systems
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software


Components: up to 03015 and fine-pitch components
Solder paste, solder joint and assembly control
Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape
Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter
System housing: 1,094 mm x 1,565 mm x 1,692 mm (W x H x D)
Camera technology: XMs
Inspection procedure: 2D, 2.5D, 3D AOI
Megapixels: up to a total of 65
Angled view camera: 8 megapixel cameras
Orthogonal camera: 10 μm resolution
Field of view size: 50 mm x 50 mm
Inspection speed: up to 65 cm²/s
PCB size: 450 mm x 350 mm (L x W)
User interface: Viscom vVision/EasyPro

Advantages at a glance

  • IPC-compliant 3D assembly inspection
  • Designed specifically for cost-effective mass production
  • Meets the most demanding cycle time requirements
  • Integrated verification for fewer false calls
  • Full connection to Industry 4.0 interfaces

Award-winning innovation

Superb innovation


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