Future-Oriented Intelligently Networked X-ray Inspection
X8011-II PCB — 3D X-ray inspection made fast, smart, and economical
The universal X8011-II PCB is designed for the reliable 2D and 3D X-ray inspection of a wide range of high-end electronics: it inspects individual components, assemblies, and even housed components as well as non-electrical components in production, quality assurance, and development. This results in a wide range of applications in the field of manual, semi-automatic, and fully automated X-ray inspection. Due to the practical, modular system approach and the X8011 II's wide range of options, its high-quality X-ray tubes, digital detectors, and axis systems can be flexibly adapted to the required inspection requirements and products. Error images are easy to classify due to the high resolution and brilliant image quality, enabling informed decisions and immediate feedback boosting product quality and cost reduction. The manual X-ray system is optimally prepared for individual tasks and at the same time intelligently integrated into the production line thanks to the Viscom Quality Uplink — for optimized process reliability and a sustainable increase in product quality.
Inspection Scope
- Fully manual or inline-compatible inspection mode
- Quick, easy inspectionprogram creation.
- Leading X-ray solutions for inline and offline X-rays
- A flexible system configuration of all Viscom X-ray tubes up to 200kV
- Optimum magnification and high-end image quality
- The application of high-resolution, digital flat-screen detectors
- Axis and module change via EasyClick
- Upgradable with Viscom-native computed tomography
- Reliable inspection in 2D and 3D in the shortest cycle time
- Intuitive user interface for manual and automatic use
- Upgradable for future inspection tasks due to the modular system design
- Automated software analyses and inspection programs
- Customized software adaptation
- Robust inspection strategies using the Viscom standard library
- Independent real-time image processing by Viscom with analysis tools
- Verification station Viscom HARAN verification station
- Viscom Quality Uplink to AOI, AXI, and SPI for cost optimization and process reliability
| Components: | Electronic components and SMT components (BGA, μBGA, flip chips, and assembled circuit boards) |
| Solder joints: | Visible and concealed solder joints |
| Defects/defect features: | Air inclusions/blow holes in the solder joint (voids), presence, offset, too much/insufficient solder, solder bridge, solder splash (optional), soldering error, non-wetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning effect, lifted lead, billboarding, supine, twist, polarity error, wick-up effect (optional), head-in-pillow (balls), THT fill level, and pin height |
| DIMENSIONS | |
| System housing: | Approx. 1144 mm x 2007 mm x 1420 mm (W x H x D) |
| System weight: | Approx. 2100 kg |
| SENSORS |
| Closed direct beam tube with 130 kV (XT9130-T) |
| Viscom micro-focus open X-ray tube 160 kV high resolution (XT9160-T ED) |
| Viscom micro-focus open X-ray tube 160 kV high resolution (XT9160-T XD) |
| Viscom micro-focus open X-ray tube 200 kV high resolution (XT9200-T ED) |
| Viscom micro-focus open X-ray tube 200 kV high resolution (XT9200-T XD) |
| INSPECTION | |
| Inspection processes: | 2D/3D X-ray inspection |
| HANDLING | Sample change through a motorized window opening |
| Max. table process area: | Horizontal X/Y axis: 460 mm x 435 mm |
| Vertical Z axis: 290 mm | |
| Max. rotation module process area: | |
| Horizontal X/Y axis: 350 mm x 430 mm | |
| Vertical Z axis: Vertical Z axis: 290 mm, n x 360° | |
| Inspection object weight: | Up to 10 kg (5 kg with rotation module) |
| SOFTWARE | |
| User interface: | Viscom XMC, Viscom SI, Viscom XVR-CT |
ADVANTAGES AT A GLANCE
- High resolution and excellent image quality
- Innovative system operation
- High-quality system components
- Universal, flexible exchangeable module for perfect sample handling
- High flexibility: Manual, semi-automatic, and fully automatic X-ray inspection
- Suitable for high-mix, low-volume manufacturing
Downloads
- White paper: Benefits of manual X-ray inspection for medium-sized electronics manufacturing
PDF Download
