Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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Peter Krippner

Peter Krippner

Member of the Executive Board operations

Peter Krippner was born in 1964, in Neustadt am Rübenberge, Region Hanover. He obtained his Abitur (German A-levels) at the Neustadt am Rübenberge secondary school in 1983; after finishing his military service, he entered the Electrical Engineering program at the University of Hanover. In 1990, he graduated with the title Diplom-Ingenieur. 

While still engaged in studies, Mr. Krippner worked as freelance employee in the software area at Viscom, where he also developed his thesis on "Automatic Inspection of Solder Joints on SMD Components." After successfully concluding his studies, he commenced permanent employment as a development engineer at the company Viscom.

Subsequently, Mr. Krippner became manager of software development in 1995 and in 1998, took responsibility for projects and applications in the solder joint inspection area. 

In 2001, Mr. Krippner was appointed to head the business unit Serial Products (SP), which he has successfully managed to May 2018. As Vice President of this unit, he was responsible for order management and development of systems for the automatic inspection of printed circuit boards (paste print, component assembly and solder joint inspection). Mr. Krippner's success also relies on his intensive contact with technical management staff of Viscom key customers.

He has been appointed to the member of the Executive Board of Viscom AG on June 2018.