Press Releases

Optimal optical 3D solder joint measurement from Viscom

Ultra-modern data exchange with the Viscom Open Interface 4.0

Viscom presents new high-resolution camera module for in-line wire bond inspection

Save the date: Viscom Technology Forum starts June 21, 2017, in Hanover

Mobile process monitoring with the new Viscom app

Networked 3D inspection from Viscom at DELTEC
