Solder Paste Inspection | 3D SPI

Conformal Coating Inspection

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Cost-effective quality assurance in mass production

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S3088 ultra chrome: maximum inspection results for efficient SMT fabrication

Viscom has developed a best-of system configuration on the basis of the successful, flexible S3088 ultra premium system. Outstanding inspection quality and extremely fast inspection speed are combined in a compact housing design with special high-speed 3D camera technology. Developed for cost-effective mass production of printed circuit boards, the S3088 ultra chrome offers reliable component inspection and measures solder joints at a resolution of 10 µm. The 3D AOI system can be intelligently networked within the production process via Quality Uplink for Industry 4.0 applications.


Inspection scope

  • Space-saving system design
  • Ideal system configuration with respect to costs/benefits
  • Rapid inspection speeds of up to 65 cm²/s
  • One orthogonal camera and eight angled view cameras provide virtually shadow-free 3D inspections
  • Verified zero defect slippage thanks to integrated verification
  • Global libraries, global calibration: transferability to all systems
  • Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
  • Traceability, offline programming, statistical process control
  • Communication with MES systems
  • Independent real-time image processing with Viscom analysis tools
  • High-performance OCR software
Components: up to 03015 and fine-pitch components

Solder paste, solder joint and assembly control

Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape
Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter
System housing: 994 mm x 1565 mm x 1349 mm (W x H x D)
Camera technology: XMs
Inspection procedure: 2D, 2.5D, 3D AOI
Megapixels: up to a total of 65
Angled view camera: 8 megapixel cameras
Orthogonal camera: 10 μm resolution
Field of view size: 50 mm x 50 mm
Inspection speed: up to 65 cm²/s
PCB size: 508 mm x 508 mm
User interface: Viscom vVision/EasyPro

Advantages at a glance

  • IPC-compliant 3D assembly inspection
  • Designed specifically for cost-effective mass production
  • Meets the most demanding cycle time requirements
  • Integrated verification for fewer false calls


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