Cost-effective quality assurance in mass production
S3088 ultra chrome: maximum inspection results for efficient SMT fabrication
Viscom has developed a best-of system configuration on the basis of the successful, flexible S3088 ultra premium system. Outstanding inspection quality and extremely fast inspection speed are combined in a compact housing design with special high-speed 3D camera technology. Developed for cost-effective mass production of printed circuit boards, the S3088 ultra chrome offers reliable component inspection and measures solder joints at a resolution of 10 µm. The 3D AOI system can be intelligently networked within the production process via Quality Uplink for Industry 4.0 applications.
Inspection scope
- Space-saving system design
- Ideal system configuration with respect to costs/benefits
- Rapid inspection speeds of up to 65 cm²/s
- One orthogonal camera and eight angled view cameras provide virtually shadow-free 3D inspections
- Verified zero defect slippage thanks to integrated verification
- Global libraries, global calibration: transferability to all systems
- Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking
- Traceability, offline programming, statistical process control
- Communication with MES systems
- Independent real-time image processing with Viscom analysis tools
- High-performance OCR software
| Components: | up to 03015 and fine-pitch components |
Solder paste, solder joint and assembly control
| Defects/defect features: | excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape |
| Optional: | free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter |
| DIMENSIONS | |
| System housing: | 994 mm x 1565 mm x 1349 mm (W x H x D) |
| INSPECTION | |
| Camera technology: | XMs |
| Inspection procedure: | 2D, 2.5D, 3D AOI |
| Megapixels: | up to a total of 65 |
| Angled view camera: | 8 megapixel cameras |
| Orthogonal camera: | 10 μm resolution |
| Field of view size: | 50 mm x 50 mm |
| Inspection speed: | up to 65 cm²/s |
| HANDLING | |
| PCB size: | 508 mm x 508 mm |
| SOFTWARE | |
| User interface: | Viscom vVision/EasyPro |
Advantages at a glance
- IPC-compliant 3D assembly inspection
- Designed specifically for cost-effective mass production
- Meets the most demanding cycle time requirements
- Integrated verification for fewer false calls
